Industry Press
Seika Machinery Releases McDry Introduction Video Showcasing Innovative Dry Cabinets
Seika Machinery, Inc.
Indium Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
Indium Corporation
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
ZESTRON
Littelfuse Unveils Single Cell Super Capacitor Protection IC for Enhanced Backup Power Solutions
Littelfuse
Koh Young Extends Invitation to the 2024 IEEE ECTC
Koh Young Technology
SiC power equipment manufacturing: an industry riding a roller-coaster
YOLE Group
2024 IEEE ECTC to Spotlight Cutting-Edge Microelectronics Packaging
IEEE ECTC
OMNIVISION Unveils Two New Global Shutter Sensors for Machine Vision Applications
OMNIVISION
MORE INDUSTRY PRESS
What Year Was It?
The day was May 2. What year was it?
Loch Ness Monster sighted
What Year
Although accounts of an aquatic beast living in Scotland's Loch Ness date back 1,500 years, the modern legend of the Loch Ness Monster is born when a sighting makes local news.
See the answer below.
What Year Was It Answer
Loch Ness Monster sighted
Answer: May 2, 1933
May 2, 2024
image
World's Biggest Neuromorphic Computer Can Run Deep Learning
Sandia National Labs commissions Hala Point, the world’s largest neuromorphic computer, built by Intel with 1152 Loihi 2 chips totaling 1.15 billion neurons. It supports brain-inspired and deep learning networks, pushing the boundaries of scale and efficiency in AI research.
EE Times
Worldwide Silicon Wafer Shipments Dip 5% in Q1 2024, SEMI Reports
Global silicon wafer shipments dropped by 5% in Q1 2024, reports SEMI. This decline reflects challenges in the semiconductor supply chain, impacting various industries reliant on silicon wafers for electronic manufacturing.
SEMI
S-SWIFT® Packaging with Fine Pitch Embedded Trace RDL
S-SWIFT® packaging was successfully demonstrated by heterogeneous integration of the ASIC and HBMs with ETR technology and Flip Chip assembly.
Technical Paper
Design Considerations In Photonics
Exploring the evolving landscape of photonics in chip design, experts delve into key considerations for integrating light-based technologies, including material selection, packaging challenges, and the potential for enhanced performance in next-gen computing and communication systems.
Semiconductor Engineering
Smarter MCUs Keep AI at the Edge
Advanced microcontrollers are revolutionizing AI integration at the edge, empowering devices with enhanced processing capabilities. This innovation enables efficient real-time decision-making, paving the way for smarter, more responsive technology in various applications.
EE Times
Advanced Micro Devices gives a lukewarm forecast
AMD, the second-largest processor maker, forecasts Q2 revenue at $5.7 billion due to sluggish video game chip demand. Despite a disappointing Q1, they anticipate growth fueled by AI accelerators, projecting $3.5 billion from new products.
Taipei Times
Microsoft Corp to build Thai data center region
Microsoft announced the establishment of Thailand's inaugural data center region to enhance cloud and AI infrastructure, vowing to train over 100,000 individuals in AI. CEO Satya Nadella sees Thailand's potential for a digital-first, AI-driven future, supported by Prime Minister Srettha Thavisin.
Taipei Times
Is AI the Killer Application for Silicon Photonics?
Silicon photonics emerges as a game-changer, fueling the growth of AI applications. With its high-speed data transfer and energy efficiency, it promises to unlock new frontiers in AI processing, potentially becoming its killer application.
EE Times
Blog Review: May 1
May 1-2 Blog Review: AI's Role in Semiconductor Innovation Explored. Insights delve into AI's transformative impact on chip design, emphasizing efficiency gains and novel applications, driving advancements across industries.
Semiconductor Engineering
Samsung vows to triple AI memory chip supply in 2024
Samsung Electronics announced a more than threefold increase in HBM semiconductor supply. It introduces the HBM3E chip, stacking eight DRAM memory chips and plans mass production of a 12-layer variant. Operating profit surged 931.87% YoY.
EE Times
Expect a Wave of Wafer-Scale Computers
TSMC unveils cutting-edge packaging technology, poised to revolutionize semiconductor industry. Advanced Integrated Fan-Out with Via-Last technology promises enhanced performance and efficiency, paving the way for smaller, more powerful electronic devices.
IEEE Spectrum
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Test Your Knowledge
What is the main ingredient in glass?
See answer below.
Quote of the Day
"If you want to make peace, you don't talk to your friends. You talk to your enemies."
Moshe Dayan
Industry Calendar
May 7, 2024
Intro to Semiconductor Design & Fabrication
SEMI
May 8, 2024
Overview of semiconductor manufacturing
SEMI
May 13, 2024
Advanced Semiconductor Manufacturing Conference (ASMC)
SEMI
May 14, 2024
Intro to IC Packaging and Assembly
SEMI
May 15, 2024
Flip Chip Packaging
SEMI
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Test Your Knowledge Answer
What is the main ingredient in glass?
Answer: Silica, in the form of sand. Only sand of exceptional purity can be used to make glass. If the sand contains a trace of iron, for instance, the glass made with it will have a greenish color.