December 12, 2025

Chiplets vs. Soft IP: Different In Almost Every Way Chiplet experts warn that physical-level chiplets, unlike configurable soft IP, restrict customization and raise integration, testing, and cost challenges. While they enable mix-and-match subsystems, their fixed functions and market dynamics limit flexibility. Semiconductor Engineering

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IBM Says It or Google Will Win Quantum Advantage Race IBM is racing Google to achieve quantum advantage within a year, aiming to run computations beyond classical capabilities on 100+ qubit systems. Using superconducting qubits, IBM leverages advanced fabrication and packaging to boost speed, fidelity, and practical applications. EE Times

Analysis Of Multi-Chiplet Package Designs and Requirements for Production Test Simplification This white paper discusses the rising complexity of multi-die semiconductor packages, challenges in testing interconnected chips, and how standards like UCIe simplify production testing workflows. Technical Paper

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New materials could boost the energy efficiency of microelectronics MIT researchers debut a low-temperature process that stacks transistors and memory in a chip's back end, slashing data-movement energy. Ultrafine indium oxide enables faster, more efficient devices for AI and advanced computing workloads. MIT News

Marvell Eyeing Connectivity as the Next Big Thing in AI Marvell's COO Chris Koopmans spotlights connectivity as AI's next bottleneck, pushing CXL adoption, advanced packaging, and Celestial AI photonic chiplets. Marvell highlights scalable memory and optical solutions that boost efficiency across large AI clusters. EE Times

Sponsor Large Capacity Plasma Treatment System - FlexTRAK-SHS 9.6-liter plasma process chamber handles larger, or more, strips increasing throughput and productivity for electronics/semiconductor packaging. Nordson Electronics Solutions

Technical Papers Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG A Universal AI-Powered Segmentation Model for PCBA & Semiconductor Peer viewpoint: semiconductor innovation for telecommunication networks MORE TECHNICAL PAPERS

Sponsor Effect of Package Warpage and Composite CT on Failure Modes Researchers analyze board-level reliability of surface mount devices in thermal cycling, identifying failure modes via warpage and strain data. Akrometrix

Broadcom beats on earnings and revenue, says AI chip sales will double in current quarter Broadcom projected $19.1 billion in fiscal first-quarter revenue, up 28% year-over-year, driven by AI chip sales doubling to $8.2 billion. Net income surged 97% to $8.51 billion, as custom chips for Google and Anthropic fuel its growth. CNBC

Tiny Chips Could Lead to Giant Power Savings Startup PowerLattice has miniaturized high-voltage regulators into tiny chiplets placed millimeters from processors, cutting AI GPU power loss. The design shrinks inductors using a magnetic alloy, potentially halving energy consumption and doubling performance per watt in data centers. IEEE Spectrum

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Nvidia's new software could help trace where its AI chips end up Nvidia is developing software to provide location verification for its AI GPUs, enabling customers to monitor usage and ensure compliance with U.S. export controls. The read-only system tracks telemetry without a "kill switch," aiming to prevent restricted chip use in China. CNBC

Thermal Management In 3D-IC: Modeling Hotspots, Materials, & Cooling Strategies As 3D-ICs drive AI, HPC, and advanced edge systems, thermal management has become a critical design factor. Early electrothermal planning now shapes stack feasibility, block placement & materials selection, addressing extreme localized heat & ensuring performance and reliability. Semiconductor Engineering

Sponsor Dicing Die-Attach Film (DDAF) or Dicing Die-Attach Tape (DDAT) AI Technology pioneered the use of flexible die-attach film and paste adhesives for larger chip and die bonding. We now have extended our adhesive line. See more AI Technology, Inc.

Global XR Shipments Rebound Behind Glasses-First Momentum, IDC Reports Global XR device shipments will surge 41.6% to 14.5 million in 2025 as slimmer XR glasses gain mainstream traction. Meta dominates with 75.7% share, but rising rivals and new platforms from Google and Apple are set to intensify competition. IDC

Nvidia supplier SK Hynix eyes U.S. listing as it expands on the AI boom SK Hynix said it is considering a U.S. listing as its valuation surges on booming AI chip demand. A potential ADR offering using treasury shares could boost corporate value and narrow its valuation gap with U.S. rivals while supporting expansion plans. CNBC

Sponsor 6 Common Mistakes of BGA Rework BGA rework is one of the most challenging procedures you may need to master. Doing it right depends in large part on the skills and knowledge of the rework technician. Learn more ... Circuit Technology Center

AI’s US$400 billion problem: Are chips getting old too fast? The tech industry's US$400 billion AI hardware spree is drawing scrutiny as rapid chip obsolescence, high failure rates and "creative bookkeeping" fears raise warnings of an overheated bubble. Analysts say shorter chip lifespans could slash profits and jolt the AI-driven economy. South China Morning Post

Sponsor Amkor's System in Package (SiP) Solutions Amkor's SiP technology is an ideal solution in markets that demand a smaller size with increased functionality. Learn more. Amkor Technology, Inc.