January 23, 2026

An Explosion In Interconnect Complexity Electronics routing has grown from two layers to five, boosting flexibility while raising complexity. Higher performance, power, and density are pushing substrates, 3D stacking, TSVs, and hybrid bonding, with thermal management a critical hurdle. Semiconductor Engineering

Sponsor Does Water Do the Job on Its Own? Matching a cleaning agent to the soil it cleans is key because cleaning only with deionized water may not always be effective when cleaning electronics. Download to learn more. KYZEN

VIEWPOINT 2026: Dr. Michael Zeuner, CEO, scia Systems GmbH Across the semiconductor industry, applications like AI processors and photonic ICs (PICs), as well as emerging technology enablers like heterogeneous integration and advanced packaging, are pushing device complexity to extreme levels. As designs become more three-dimensional, this increasing ... scia Systems GmbH

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor A universal AI & Deep Learning powered model that enhances defect detection in AOI systems for PCBAs and semiconductors, further improving accuracy, speed and consistency - streamlining inspection processes. Technical Paper

Sponsor Die Bonding Made Easy The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO. DL Technology

Electronics Industry 2026: Early Signs of Optimism In 2025, the electronics industry saw explosive AI growth, strong U.S. performance, and China's export dominance, while Europe struggled. Security, defense spending, and edge AI offer new opportunities, setting the stage for cautious yet accelerating industry growth in 2026. EE Times

A Mixed Bag of Chips: Significant New Import and Export Changes for Advanced Semiconductors The U.S. government eased export controls on advanced computing chips to China while imposing a 25% Section 232 tariff on certain semiconductor imports. The policies aim to boost domestic manufacturing, support U.S. data centers, and profit from China-bound chip sales. Wilson Sonsini

Sponsor Effect of Package Warpage and Composite CT on Failure Modes Researchers analyze board-level reliability of surface mount devices in thermal cycling, identifying failure modes via warpage and strain data. Akrometrix

Technical Papers Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG MORE TECHNICAL PAPERS

Sponsor Temporary Bonding Materials Brewer Science offers temporary bonding solutions with high adhesion and high thermal stability (≥ 400˚C) to enable thinning ≤ 50 µm. Brewer Science

Intel stock plunges 13% on soft guidance, concerns about chip production Intel beat Wall Street expectations with fourth-quarter earnings but warned of soft first-quarter guidance due to supply constraints. CEO Lip-Bu Tan emphasized improving production yields, while strong AI-driven data center chip sales bolstered optimism for future growth. CNBC

Semiconductor stocks soar on AI sentiment Global semiconductor stocks surged as Nvidia CEO Jensen Huang's Davos remarks fueled AI optimism. Samsung hit a record, KOSPI topped 5,000, and SoftBank jumped 11.6%, reflecting investor enthusiasm for the trillion-dollar AI infrastructure buildout worldwide. Taipei Times

Sponsor McDry Ultra-Low Humidity Storage Cabinets McDry dry cabinet for MSL components and desiccators provide optimal ultra-low humidity and moisture-proof storage for IC packages. Seika

OpenAI chair Bret Taylor says AI is 'probably' a bubble, expects correction in coming years Bret Taylor, OpenAI board chair and Sierra co-founder, warned Thursday that AI is likely a bubble fueling widespread investment. Speaking in Davos, he predicted market corrections and consolidation but emphasized that competition will drive innovation across industries. CNBC

Chinese AI chipmaker Moore Threads sees tripling of revenue amid self-sufficiency push Moore Threads expects 2025 revenue to triple to around US$208 million, driven by mass adoption of its MTT S5000 AI chip. The Beijing-based firm narrowed losses, boosted investor enthusiasm, and exemplifies China's rapid push for domestic semiconductor self-sufficiency. South China Morning Post

Sponsor Hermetic Package Seam Seal with HDHS® Technology Brings a new level of precision and automation for hi-rel microelectronic package encapsulation, increasing seal yields to 99.99% and lowering operation costs for Aerospace, Military, Microwave, Photonics and MEMS. MicroCircuit Laboratories, LLC

Trump and Nvidia have ruffled the feathers of Washington's China hawks President Trump's plan to let Nvidia export powerful H200 AI chips to China is sparking bipartisan concern in Congress. Lawmakers advancing the AI Overwatch Act aim to block shipments, citing national security risks, while the White House argues exports maintain U.S. tech dominance. CNBC

Every Atom Now Counts In Advanced Chip Manufacturing AI workloads are pushing chip design past classic transistor scaling, accelerating a shift to 3D architectures. Advanced materials and atomic-layer deposition now boost performance, reliability, and power efficiency in complex AI accelerators. Semiconductor Engineering

Sponsor Is copper sintering the future of WBG semiconductors? Silver dominates today, but copper is catching up fast. Explore the cost, reliability, and sustainability shifts reshaping GaN and SiC die attach technology. Henkel AG & Co.

Ripple Effects: Why Water Risk Is The Next Major Business Challenge For The Semiconductor Industry Water risk is rising for chipmakers as fabs consume millions of gallons a day. The Ripple Effects report urges site-specific stewardship, catchment-wide collaboration, and smart tech to protect supply chains and build long-term operational resilience Semiconductor Engineering

Sponsor Emerging Tech for 3D Packaging Enables More-than-Moore Era AI-based 3D X-ray microscopy & LaserFIB enable fast, precise analysis for reliable package development with high throughput & success rates. ZEISS Microscopy