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Nordson Test & Inspection
SQ7000+TM Multi-Function for 3D AOI, SPI & CMM
The SQ7000+ with MRS® sensor technology delivers high-resolution, high-speed inspection and metrology, uniquely combining AOI, SPI, and CMM in one in-line system.
Nordson Test & Inspection
S-SWIFT Technology
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StratEdge Corporation
Die Attach Material Comparisons
Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability.
StratEdge Corporation
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Sponsor
Heller Industries
Void-Free Pressure Curing with Ultra Clean Results
Trusted for bond integrity in optical modules and 3D packaging. Achieve void-free curing results in an oxygen-controlled, contamination-free atmosphere.
Heller Industries
M827