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Epoxy for Dam-and-Fill Applications
Master Bond EP17HTDM-2 Black is a high temperature resistant, non-drip adhesive for bonding, sealing, encapsulating and dam-and-fill applications.
Master Bond
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Trace Analytical for Semiconductor Industry
Balazs™ provides the following analytical services with a commitment to absolute quality control: Water analysis, Chemical analysis, Gas analysis, Particle analysis, Material analysis, Part analysis, and Cleanroom Evaluation analysis.
Balazs Nanoanalysis
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Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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