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Current Characterization of Various Cu RDL Designs In WLP
This study evaluates copper redistribution layer fusing currents in WLP through experiments and simulations, finding that silicon thickness significantly improves heat dissipation and fusing performance.
Amkor Technology

Technical Paper

Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications

This study demonstrates that molded flip chip BGA packages with optimized EMC materials and process parameters achieve superior warpage control and reliability performance compared to conventional FCBGA designs.
Amkor Technology

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Fine-Pitch MEMS Bonding Precision
Upgrade MEMS cantilever bonding with LAPLACE^®-CAN. Laser-assisted accuracy, 30µm pitch, and inline repair for perfect wafer probe cards every time.
PacTech