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EZ-FLO High Precision Dispense Tips
Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more.
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Technical Paper

Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications

This study demonstrates that molded flip chip BGA packages with optimized EMC materials and process parameters achieve superior warpage control and reliability performance compared to conventional FCBGA designs.
Amkor Technology

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Targeted Sample Preparation for Deeply Buried ROI in Advanced Packages
New fault isolation technique using 3D X-ray microscopy & LaserFIB to pinpoint, isolate & open a 20 µm wirebond without damage to adjacent wires.
ZEISS Microscopy