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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS

Technical Paper

Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications

This study demonstrates that molded flip chip BGA packages with optimized EMC materials and process parameters achieve superior warpage control and reliability performance compared to conventional FCBGA designs.
Amkor Technology

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More Technical Papers

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Full Technical Paper List

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1 of 10 Applications: Hybrid Bonding
Swiss made Tresky die bonders can be equipped with an atmospheric plasma unit to provide flawless surfaces on chips or substrates for perfect bond results.
Dr. Tresky AG