Sponsor

Packaging Solutions for Unique Markets
The MLF/QFN packaging technology is the fastest-growing IC packaging solution today. MLF/QFN packaging solutions represent a >111B-unit market across five unique markets.
Amkor Technology, Inc.

Technical Paper

Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications

This study demonstrates that molded flip chip BGA packages with optimized EMC materials and process parameters achieve superior warpage control and reliability performance compared to conventional FCBGA designs.
Amkor Technology

Complete this form to download this Technical Paper.

More Technical Papers

■	Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications
■	Eliminating Interfacial Delamination in High-Power Automotive Devices
■	RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
■	A Universal AI-Powered Segmentation Model for PCBA & Semiconductor
■	Peer viewpoint: semiconductor innovation for telecommunication networks
■	Current Characterization of Various Cu RDL Designs In Wafer Level Packages (WLP)
■	Peer viewpoint: AI data centers are driving a semiconductor revolution
■	Advanced Microelectronic Packaging and Fiber Optics Technologies for the Military, Defense & Security Industries
■	Analysis Of Multi-Chiplet Package Designs and Requirements for Production Test Simplification
■	The Evolution of Inspection and Metrology in the AI Era

Full Technical Paper List

Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

Die Bonding Made Easy
The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO.
DL Technology