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IR Layer Release Technology for 3D Packaging and Logic Scaling
Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling.
EV Group

Technical Paper

Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications

This study demonstrates that molded flip chip BGA packages with optimized EMC materials and process parameters achieve superior warpage control and reliability performance compared to conventional FCBGA designs.
Amkor Technology

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Chiplets and Advanced Packaging
Chiplets represent a transformative approach to semiconductor design. This paper underscores the critical relationship between chiplets and material testing. Download now.
XYZTEC