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Technical Paper

Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications

This study demonstrates that molded flip chip BGA packages with optimized EMC materials and process parameters achieve superior warpage control and reliability performance compared to conventional FCBGA designs.
Amkor Technology

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Full Technical Paper List

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Ultra-Thin Wafer Handling
Brewer Science temporary wafer bonding systems allow for safe handling and transport of ultrathin wafers during rigorous backside processing steps.
Brewer Science