semiconductor
packaging news
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
Amkor-Technology
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
Contact Us
Please let us know how we can serve you better... provide you with more information... make your job easier. Please use the form below.

You can also contact us directly by phone or email. Visit our About Us page for more information.

Complete this form to contact us.

Your Name


Your Company
Your E-mail


Your State, or Country if outside USA
Questions/Comments


Authentication

Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Plasma-Etch

High Capacity & Power Plasma Systems
The BT-1 high capacity plasma systems features 5 shelves & high power plasma up to 5000 watts! Reactive Ion Etching chamber configurations with liquid cooling are also available.
Plasma Etch
Akrometrix