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Underfill Epoxy Offers Thermal Conductivity
Master Bond EP29LPTCHT is a low viscosity adhesive that can be used for underfill & encapsulation apps. It offers thermal conductivity & electrical insulation.
Master Bond

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Fusion and Hybrid Bonding Experts
EVG's industry-leading process solutions, expertise and HI Competence Center accelerate the development and implementation of heterogeneous integration technology.
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