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One Component, Fast Curing Epoxy
Master Bond EP4EN-80 is a NASA low outgassing approved adhesive for potting and encapsulation. It cures at 80°C and features thermal conductivity and electrical insulation.
Master Bond

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SB²® Solder Ball Jetting: Fast, Clean, Reliable
Achieve fast, precise, and clean solder ball placement with SB²®—ideal for flip chip, reballing, and advanced packaging from wafer to panel level. Learn More.
PacTech