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Sponsor
Brewer-Science

Temporary Bonding Materials
Brewer Science offers temporary bonding solutions with high adhesion and high thermal stability (≥ 400˚C) to enable thinning ≤ 50 µm.
Brewer Science
IMAPS
Sponsor
Brewer-Science

Temporary Bonding Materials
Brewer Science offers temporary bonding solutions with high adhesion and high thermal stability (≥ 400˚C) to enable thinning ≤ 50 µm.
Brewer Science
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Sponsor
Master-Bond

Chemically Resistant, UV Curable Epoxy
Master Bond UV26SP is a low outgassing UV curing system with high temperature and chemical resistance for bonding, sealing and coating.
Master Bond
Indium-Corporation