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The Leader of Advanced Packaging Thermal Solutions
From 3D & CoWoS to SiP, PoP & Hybrid Bonding—we support every advanced process. Perfect reflow & curing for micro-bumping, underfill & TIM attach. Upgrade your yield.
Heller Industries

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Cleaning Silicone and Hydrocarbon Residue Using Atmospheric Plasma
Residue from dicing tape and silicone trays can hinder chip bonding. ONTOS effectively cleans surfaces before bonding. Read more.
Ontos