Hi-Rel Hermetic Package Sealing
Automated processing by the Robotic Cover Sealer. No skilled manual labor in cover seal. Robotic Materials Manager walk away automation provides rapid ROI. MicroCircuit Laboratories, LLC
Technical Paper
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura International
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Ultra-Thin Wafer Handling
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