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Sponsor
Akrometrix

Effect of Package Warpage and Composite CT on Failure Modes
Researchers analyze board-level reliability of surface mount devices in thermal cycling, identifying failure modes via warpage and strain data.
Akrometrix
Master-Bond
Sponsor
Akrometrix

Effect of Package Warpage and Composite CT on Failure Modes
Researchers analyze board-level reliability of surface mount devices in thermal cycling, identifying failure modes via warpage and strain data.
Akrometrix
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Sponsor
Ironwood-Electronics

ATE Test Contactor for MSOP10
Test, debug, setup for production run of MSOP10 in Esmo Talos handler. Picoraptor2 can test 500K devices before replacement is needed.
Ironwood Electronics
Nordson-ASYMTEK