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Tech Paper - The Essential Guide for High-Reliability BGA Component Re-balling
This paper outlines best practices and challenges in reballing Ball Grid Array (BGA) components. Download this free tech paper.
Circuit Technology Center
EV-Group
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Circuit-Technology-Center

Tech Paper - The Essential Guide for High-Reliability BGA Component Re-balling
This paper outlines best practices and challenges in reballing Ball Grid Array (BGA) components. Download this free tech paper.
Circuit Technology Center
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Amkor-Technology

LAB Flip Chip Reflow Process Robustness Prediction
Predicting laser-assisted bonding (LAB) parameters and ideal solder temperature range for a black box substrate. Read more.
Amkor Technology, Inc.
Plasma-Etch