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Apr 6, 2021 Semiconductor Device Innovation Driving Automotive Advances Today's automobiles are computers on wheels, with some vehicles containing more than 3,500 semiconductors! How are auto engineers ensuring reliability ... Henkel Corporation Mar 23, 2021 Non-Surface Contact Approach For Device Flip Not all wafer level packages can be sorted, picked, flipped and re-packaged using traditional vacuum tip technology. Non-surface contact handling ... Royce Instruments Mar 1, 2021 BGA Socket Considerations - Prototype to Reality For products designed with high-performance integrated circuits, BGA socketing systems are an essential option during the design, testing, and/or production ... Ironwood Electronics Feb 22, 2021 EMI Shielding for System in Package Using Spray Coating and Silver Particle-Free Ink This paper demonstrates the capability of EMI-207, a metal-complex conductive ink that sets the standard for particle-free conductive coatings, combined ... EMD Electronics Feb 8, 2021 Improved Wire Bond Reliability with Auxiliary Wires Auxiliary wires are commonly defined as an additional wire outside of a normal ball-to-stitch wire bond. The motivation behind the ... Palomar Technologies, Inc. Jan 26, 2021 Adding Value with Unit Level Traceability (ULT) in Automotive Packaging Automotive manufacturers rely on traceability to keep abreast of gaps in the value chain to meet end-user safety requirements. ... Amkor Technology, Inc. Jan 11, 2021 TLPS Paste Vias for High-Performance Printed Circuit Board Fabrication Ormet® delivers high reliability anywhere and any layer vias for high density interconnects in complex printed circuit boards. ... EMD Electronics Jan 4, 2021 Full Wafer Double Sided Monolithic Lens Fabrication In this paper, we discuss the capability of SUSS UV-imprint lithography together with an optically tailored, UV-curable epoxy resin from ... SUSS MicroTec Dec 21, 2020 Removing Underfill for Analysis of 2.5D Modules Using CF4-Free Microwave Induced Plasma Selective removal of underfill on a 2.5D package to enable subsequent analysis on interposer interconnects and Cu µbumps in cross-section ... JIACO Instruments Dec 14, 2020 Side Wettable Flanks for Leadless Automotive Packaging Amkor's Wettable Flank technology for QFN (MLF®) packages streamlines solder joint inspection, enabling automotive and PCB assemblers to eliminate manual ... Amkor Technology, Inc. |
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