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Jul 13, 2026 A New Optical Ball Grid Array Package Development for Automotive Optical Sensor This study develops a robust optical ball grid array package for automotive image sensors, optimizing materials, design, and processes to ... Amkor Technology, Inc. May 6, 2026 Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications This paper explores how, with chips becoming smaller and mightier, automated x-ray metrology delivers game-changing quality and efficiency in wafer ... Nordson Test & Inspection Feb 6, 2026 Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging As advanced packaging density increases, alpha particle emissions present a growing reliability risk. This article examines soft error mechanisms and ... MacDermid Alpha Electronics Solutions Jan 21, 2026 Revolutionizing IC Packaging with High-Density RDL Technology Amkor's S-SWIFT packaging technology addresses advanced IC packaging challenges through an embedded trace RDL process, providing higher bandwidth die-to-die interconnects ... Amkor Technology Jan 9, 2026 EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Debugging D2D I/O failures in heterogeneous packages is increasingly difficult due to limited access and test granularity. This paper shows ... TeraView Dec 10, 2025 Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and ... StratEdge Corporation Nov 25, 2025 Package Assembly Design Kits: The Future of Advanced Package Design This white paper advocates for Package Assembly Design Kits (PADK) to streamline high-density fan-out package design by integrating manufacturing verification ... Amkor Technology Oct 1, 2025 Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications This study demonstrates that molded flip chip BGA packages with optimized EMC materials and process parameters achieve superior warpage control ... Amkor Technology Aug 13, 2025 Eliminating Interfacial Delamination in High-Power Automotive Devices This study demonstrates that coating power devices with APTES adhesion promoter after wire bonding eliminates interfacial delamination, providing a simpler ... Amkor Technology Aug 6, 2025 RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs ... Uyemura International |
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