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Jan 21, 2026 Revolutionizing IC Packaging with High-Density RDL Technology Amkor's S-SWIFT packaging technology addresses advanced IC packaging challenges through an embedded trace RDL process, providing higher bandwidth die-to-die interconnects ... Amkor Technology Jan 9, 2026 EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Debugging D2D I/O failures in heterogeneous packages is increasingly difficult due to limited access and test granularity. This paper shows ... TeraView Dec 10, 2025 Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and ... StratEdge Corporation Nov 25, 2025 Package Assembly Design Kits: The Future of Advanced Package Design This white paper advocates for Package Assembly Design Kits (PADK) to streamline high-density fan-out package design by integrating manufacturing verification ... Amkor Technology Oct 1, 2025 Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications This study demonstrates that molded flip chip BGA packages with optimized EMC materials and process parameters achieve superior warpage control ... Amkor Technology Aug 13, 2025 Eliminating Interfacial Delamination in High-Power Automotive Devices This study demonstrates that coating power devices with APTES adhesion promoter after wire bonding eliminates interfacial delamination, providing a simpler ... Amkor Technology Aug 6, 2025 RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs ... Uyemura International Jul 30, 2025 A Universal AI-Powered Segmentation Model for PCBA & Semiconductor A universal AI & Deep Learning powered model that enhances defect detection in AOI systems for PCBAs and semiconductors, further ... Nordson Test & Inspection Jul 23, 2025 Peer viewpoint: semiconductor innovation for telecommunication networks Telecom networks are evolving rapidly to handle higher speeds & volumes. Henkel surveyed 170 semiconductor leaders to reveal how performance, ... Henkel AG & Co. Jul 16, 2025 Current Characterization of Various Cu RDL Designs In Wafer Level Packages (WLP) This study evaluates copper redistribution layer fusing currents in wafer-level packaging through experiments and simulations, finding that silicon thickness significantly ... Amkor Technology |
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