Technical Papers Index
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443 technical papers.

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Sep 22, 2023
Decapsulation of Multi-Tier Wire-Bonded Semiconductors
Decapsulation of packaged integrated circuits is routinely conducted in FA and reliability tests. In this work, we decapsulate a complex ...
JIACO Instruments

Sep 15, 2023
Series B : Adhesion and Bondibility of Al2O3-coated Bonding Wire
Using Atomic Layer Deposition (ALD), we applied a nanoscale Al2O3 ceramic coating to metal bonding wires, enhancing adhesion, insulation, and ...
OxWires Co., Ltd

Sep 8, 2023
How to Select RF Test Socket
Selecting the right RF test socket involves several factors – frequency, insertion loss, return loss, impedance matching, contact force, contact ...
Ironwood Electronics

Aug 31, 2023
3D Sensing Solutions
Optical sensor packaging standardization for a growing market. Extending the MEMS and Sensor Platform to New Optical Sensors for Emerging ...
Amkor Technology, Inc.

Aug 24, 2023
Critical Cleaning Requirements to Overcome Advanced Packaging and Defluxing Challenges
As technology advances, wafer-level packages have emerged in many different varieties. Computing has evolved significantly over the years. ...
ZESTRON Americas

Aug 11, 2023
Reliably Reinforce BGAs While Minimizing Stress on Solder Joints
Learn how to reinforce BGAs while minimizing stress on solder joints with capillary underfill, edge bond and corner fill and ...

Aug 2, 2023
Series A: Electrical Insulation of Al2O3-Coated Bonding Wire
We introduce ceramic (Al2O3) coating at nm scales deposited on metal wires for enhancing electrical insulation, adhesion to encapsulation and ...
OxWires Co., Ltd

Jul 25, 2023
Production Testing Of Discrete Power Products
Test steps and parameters for new and established power technologies. ...
Amkor Technology, Inc.

Jul 19, 2023
Essential Inspection Requirements in the Era of Convergence
The convergence of semiconductor packaging and board assembly is revolutionizing the industry with innovative inspection machines. This paper explores requirements ...
Koh Young America, Inc.

Jul 13, 2023
Photosensitive Permanent Bonding Material Designed for Polymer/Metal Hybrid Bonding Applications
In this paper, a novel negative-tone, photosensitive, polymeric bonding material is proposed that can be used as a dielectric enabling ...
Brewer Science, Inc.

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