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Dec 5, 2024 Plasma as a Key Technology: Increasing Efficiency and Quality Assurance in the Electronics Industry Plasma technology improves electronics manufacturing, reduces oxide layers without the use of flux, prevents delamination, improves adhesion and enables environmentally ... Plasmatreat GmbH Nov 26, 2024 Electromigration Performance Of Fine-Line Cu RDL For HDFO Packaging The study highlights High-Density Fan-Out (HDFO) packages' fine copper redistribution layer (Cu RDL) reliability under electromigration (EM). Findings include distinct ... Amkor Technology, Inc. Oct 23, 2024 LAB Flip Chip Reflow Process Robustness Prediction By Thermal Simulation Mass reflow (MR) processes face challenges with package warpage and solder joint quality in fine-pitch devices. Laser-assisted bonding (LAB) offers ... Amkor Technology, Inc. Sep 30, 2024 Determining Chemistry Compatibility and Solubility Comparison for Cu Pillar Flip Chip Cleaning Evaluating appropriate chemistries to remove WS Flux residues and refining cleaning processes can meet challenges associated with producing Cu Pillar ... KYZEN Sep 23, 2024 Enabling A Chiplet Supply Chain Chiplet-based architectures are on the rise, offering smaller die sizes and improved yields over large SoCs. Despite benefits in cost ... Amkor Technology, Inc. Sep 16, 2024 Incorporating EOTPR in Chip-Level Failure Analysis Workflow: Case Studies The paper showcases six failure analysis case studies comparing TeraView's Electro Optical Terahertz Time Reflectometry (EOTPR) with other electrical fault ... TeraView Sep 5, 2024 Detecting Wafer Level Cu Pillar Defects Using 3D X-ray Microscopy (XRM) with Submicron Resolution Two case studies show how advanced high-resolution 3D XRM can detect and visualize defects in Wafer Level Chip Scale Packages ... ZEISS Aug 28, 2024 US Microelectronics Packaging Ecosystem: Challenges and Opportunities Analyzing The U.S. Advanced Packaging Ecosystem With Countermeasures To Mitigate Hardware Security Issues by strengthening domestic advanced packaging capabilities. ... University of Florida Aug 21, 2024 A Hybrid PLP Technology Based On A 650 X 650 mm Platform A novel panel-level packaging technology, Hybrid PLP, reduces costs by enabling the processing of multiple wafers on a large 650mm ... Amkor Technology, Inc. Aug 14, 2024 Large Area Sintering (Half-Bridge Modules) in Power Electronics Process allows dispensing of over 100 mm² for large-area sintering applications, improving competitiveness and sustainability in e-mobility and power electronics ... Tresky GmbH |
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