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Sep 3, 2026 Bond front velocity in lubrication-mediated bonding of flexible substrates Robust theoretical model explaining bondwave velocity in direct wafer/die bonding and explaining why it accelerates. First model with predictive power to show realistic and observed values. imec Aug 25, 2026 How AI Could Cut Semiconductor Package Design Cycles from Months to Days This paper explores how AI-powered semiconductor package design tools can accelerate development, reduce errors, optimize performance and sustainability, and enhance engineer productivity, transforming package design cycles from months to days. Amkor Technology, Inc. Aug 18, 2026 5X Faster Die Sorting Accelerates U.S. Semiconductor Manufacturing Study examines how EtherCAT-networked automation enables high-speed sorting of increasingly small and fragile semiconductor dies. The equipment combines micron-level motion accuracy, gentle handling, inline testing, flexible packaging formats and production-scale throughput. Beckhoff Automation LLC Jul 13, 2026 A New Optical Ball Grid Array Package Development for Automotive Optical Sensor This study develops a robust optical ball grid array package for automotive image sensors, optimizing materials, design, and processes to mitigate thermal stresses, improve reliability, and meet stringent ADAS qualification requirements. Amkor Technology, Inc. May 6, 2026 Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications This paper explores how, with chips becoming smaller and mightier, automated x-ray metrology delivers game-changing quality and efficiency in wafer and panel level applications, while delving into industry trends. CyberOptics Corporation Feb 6, 2026 Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging As advanced packaging density increases, alpha particle emissions present a growing reliability risk. This article examines soft error mechanisms and solutions to mitigate failures in AI, HPC, and high-density packages. MacDermid Alpha Electronics Solutions Jan 21, 2026 Revolutionizing IC Packaging with High-Density RDL Technology Amkor's S-SWIFT packaging technology addresses advanced IC packaging challenges through an embedded trace RDL process, providing higher bandwidth die-to-die interconnects for AI, HPC, and data center applications with improved reliability. Amkor Technology, Inc. Jan 9, 2026 EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Debugging D2D I/O failures in heterogeneous packages is increasingly difficult due to limited access and test granularity. This paper shows how EOTPR accurately isolates chiplet interconnect defects with minimal prep, validated by a case study. TeraView Dec 10, 2025 Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now. StratEdge Corporation Nov 25, 2025 Package Assembly Design Kits: The Future of Advanced Package Design This white paper advocates for Package Assembly Design Kits (PADK) to streamline high-density fan-out package design by integrating manufacturing verification early, reducing design cycles and complexity. Amkor Technology, Inc. Oct 1, 2025 Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications This study demonstrates that molded flip chip BGA packages with optimized EMC materials and process parameters achieve superior warpage control and reliability performance compared to conventional FCBGA designs. Amkor Technology, Inc. Aug 13, 2025 Eliminating Interfacial Delamination in High-Power Automotive Devices This study demonstrates that coating power devices with APTES adhesion promoter after wire bonding eliminates interfacial delamination, providing a simpler alternative to lead frame roughening technology. Amkor Technology, Inc. Aug 6, 2025 RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation. Uyemura International Corporation Jul 30, 2025 A Universal AI-Powered Segmentation Model for PCBA & Semiconductor A universal AI & Deep Learning powered model that enhances defect detection in AOI systems for PCBAs and semiconductors, further improving accuracy, speed and consistency - streamlining inspection processes. CyberOptics Corporation Jul 23, 2025 Peer viewpoint: semiconductor innovation for telecommunication networks Telecom networks are evolving rapidly to handle higher speeds & volumes. Henkel surveyed 170 semiconductor leaders to reveal how performance, reliability & advanced integration are driving next-gen infrastructure. Henkel AG & Co. Jul 16, 2025 Current Characterization of Various Cu RDL Designs In Wafer Level Packages (WLP) This study evaluates copper redistribution layer fusing currents in wafer-level packaging through experiments and simulations, finding that silicon thickness significantly improves heat dissipation and fusing performance. Amkor Technology, Inc. Jul 8, 2025 Peer viewpoint: AI data centers are driving a semiconductor revolution AI adoption is tripling data center demand by 2030. Henkel surveyed 120 semiconductor leaders to uncover how innovation in materials and packaging is powering future-ready, high-performance infrastructure. Henkel AG & Co. Jun 20, 2025 Advanced Microelectronic Packaging and Fiber Optics Technologies for the Military, Defense & Security Industries As modern military systems become increasingly compact, autonomous, and software-driven, the need for robust microelectronic integration and secure optical communication grows exponentially. Tresky Automation Jun 13, 2025 Analysis Of Multi-Chiplet Package Designs and Requirements for Production Test Simplification This white paper discusses the rising complexity of multi-die semiconductor packages, challenges in testing interconnected chips, and how standards like UCIe simplify production testing workflows. Amkor Technology, Inc. Jun 3, 2025 The Evolution of Inspection and Metrology in the AI Era AI's rise drives demand for advanced processors, shifting the industry to chiplet architectures with high-bandwidth memory. This transformation introduces new challenges in semiconductor manufacturing, especially in inspection and metrology. Camtek USA, Inc. May 21, 2025 The Economics of Electronic Component Salvage and Reuse This paper explores the feasibility and benefits of salvaging and reconditioning the leads and pads of electronic components, focusing on high-value components such as microprocessors, microcontrollers, and artificial intelligence chips. Circuit Technology Center Inc. May 14, 2025 How Precision Motion Systems are Shaping the Future of Semiconductor Manufacturing This paper explores how precision motion systems enable key semiconductor manufacturing trends—such as node scaling, advanced packaging, and photonic integration—by delivering the accuracy required for nanoscale production and testing. Aerotech Inc. May 6, 2025 Reducing CTE Mismatch Defects in Flip Chip Reflow TrueFlat technology uses negative pressure reflow and Advanced Thermal Control (ATC) to reduce warpage, micro spikes, and CTE mismatch defects in ultra-miniaturized electronic assemblies with fragile ELK materials. BTU International, Inc. Apr 29, 2025 Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield Lead frame packages are commonly used in semiconductor package fabrication, where interconnections between the integrated circuits (IC) and the metal leads are typically established through die attach and wire bonding processes. ZESTRON Corporation Mar 25, 2025 A study about 3D stacking of passive SMD elements for advanced SMT packaging using laser assisted bonding This study demonstrates laser assisted bonding (LAB) of SMD Tantal Elko and MLCC (Multilayer Ceramic Chip Capacitor) capacitors and presents a comparison to conventional bonding using solder paste and reflow oven. PacTech Technologies Mar 11, 2025 Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components In this paper we will review how proper cleaning strategies are critical to ensuring long-term reliability in advanced packages and explore how optimized cleaning solutions can help safeguard performance and prevent failure in high-reliability applications. ZESTRON Corporation Feb 24, 2025 Multi-Sensor Metrology for the most challenging Advanced Packaging Applications Users want to measure various applications on one tool rather than several tools to get the required results. Ultra-precise, non-contact measuring techniques work for a multitude of packaging applications Camtek USA, Inc. Feb 11, 2025 Effect of Package Warpage and Composite CTE on Failure Modes in Board-Level Thermal Cycling This paper studies board level reliability for surface mount devices during thermal cycling, while specifying failure modes and locations. Failure modes are characterized using thermal warpage and surface strain data. Akrometrix, LLC Dec 24, 2024 Package Integrated Vapor Chamber Heat Spreaders Advances in vapor chamber technology revolutionize thermal management, delivering up to 12.5°C cooler performance than copper spreaders. These integrated chambers now enhance efficiency in smartphones, high-performance GPUs, and other high-power computing devices. Amkor Technology, Inc. Dec 12, 2024 Ultrasonic Bonding in semiconductor industry – The fast and clean process Ultrasonic die bonding revolutionizes semiconductor assembly with rapid processing, strong bonds, and low thermal stress. It excels in bonding dissimilar materials, advancing applications like power devices, RF components, and 3D packaging in modern electronics. Tresky Automation Dec 5, 2024 Plasma as a Key Technology: Increasing Efficiency and Quality Assurance in the Electronics Industry Plasma technology improves electronics manufacturing, reduces oxide layers without the use of flux, prevents delamination, improves adhesion and enables environmentally friendly, high performance products by using Openair-Plasma® and PlasmaPlus®. Plasmatreat GmbH Nov 26, 2024 Electromigration Performance Of Fine-Line Cu RDL For HDFO Packaging The study highlights High-Density Fan-Out (HDFO) packages' fine copper redistribution layer (Cu RDL) reliability under electromigration (EM). Findings include distinct failure modes, resistance changes, and current-carrying capacity estimations crucial for advanced electronics design. Amkor Technology, Inc. Oct 23, 2024 LAB Flip Chip Reflow Process Robustness Prediction By Thermal Simulation Mass reflow (MR) processes face challenges with package warpage and solder joint quality in fine-pitch devices. Laser-assisted bonding (LAB) offers precise, localized heating, enhancing soldering quality and reducing warpage. Amkor Technology, Inc. Sep 30, 2024 Determining Chemistry Compatibility and Solubility Comparison for Cu Pillar Flip Chip Cleaning Evaluating appropriate chemistries to remove WS Flux residues and refining cleaning processes can meet challenges associated with producing Cu Pillar flip chips to improve reliability. Kyzen Corporation Sep 23, 2024 Enabling A Chiplet Supply Chain Chiplet-based architectures are on the rise, offering smaller die sizes and improved yields over large SoCs. Despite benefits in cost and performance, challenges like power management, security, and supply chain complexity persist, with UCIe pushing for standardization. Amkor Technology, Inc. Sep 16, 2024 Incorporating EOTPR in Chip-Level Failure Analysis Workflow: Case Studies The paper showcases six failure analysis case studies comparing TeraView's Electro Optical Terahertz Time Reflectometry (EOTPR) with other electrical fault isolation techniques. It highlights EOTPR's ability to isolate faults in advanced IC packaging such as CoWoS. TeraView Sep 5, 2024 Detecting Wafer Level Cu Pillar Defects Using 3D X-ray Microscopy (XRM) with Submicron Resolution Two case studies show how advanced high-resolution 3D XRM can detect and visualize defects in Wafer Level Chip Scale Packages (WLCSP) containing RDL and Cu pillar microbumps. ZEISS Aug 28, 2024 US Microelectronics Packaging Ecosystem: Challenges and Opportunities Analyzing The U.S. Advanced Packaging Ecosystem With Countermeasures To Mitigate Hardware Security Issues by strengthening domestic advanced packaging capabilities.  University of Florida, Herbert Wertheim College of Engineering Aug 21, 2024 A Hybrid PLP Technology Based On A 650 X 650 mm Platform A novel panel-level packaging technology, Hybrid PLP, reduces costs by enabling the processing of multiple wafers on a large 650mm x 650mm panel. It enhances reliability and flexibility for advanced chip applications. Amkor Technology, Inc. Aug 14, 2024 Large Area Sintering (Half-Bridge Modules) in Power Electronics Process allows dispensing of over 100 mm² for large-area sintering applications, improving competitiveness and sustainability in e-mobility and power electronics where efficiency and reliability are essential. Tresky Automation Aug 7, 2024 A versatile stepper tool designed to address the challenges of diverse device processes This paper highlights several unique features of the stepper tool. Not only its satisfactory resolution and competitive throughput, the "PPS-8000" series demonstrates a strong capability for handling diverse device processes. ORC Manufacturing CO., LTD Jul 31, 2024 Advanced Packaging for Next-Generation Vehicle Automotive processors are swiftly adopting advanced semiconductor technologies, including 5 nm and 3 nm processes. This shift necessitates advanced packaging due to challenges in I/O density, chip size reductions, and memory bandwidth. Amkor Technology, Inc. Jul 24, 2024 The Role of Solder in Advanced Semiconductor Packaging Here we cover various packaging technologies and methods, including how solder products are integrated into these processes, while shedding light on the evolving convergence between ASP and SMT. AIM Solder Jul 17, 2024 Ultrafast ID – VG Technique for Reliable Cryogenic Device Characterization This paper presents a method for ultrafast ID-VG measurements down to 8 K, pivotal for understanding high-k device dynamics in cryogenic environments. CoolCAD Electronics LLC Jul 10, 2024 Atmospheric Plasma Simplifies Die-to-Wafer Bonding We present a simple Die-to-Wafer bonding process enabled by atmospheric plasma, eliminating the need for complicated carrier wafers and costly vacuum plasma systems. Applications include heterogeneous 3DIC and integrated photonics. ONTOS Equipment Systems Jul 1, 2024 Custom Substrates Enable Fast-Turn Package, Assembly Development Chip designers can leverage custom substrates to quickly develop optimal packaging and assembly solutions for high-speed, high-performance devices, overcoming time-to-market challenges. QP Technologies Jun 21, 2024 Case Study: Improving Yield for Chip-on-Wafer Underfill Leading IC manufacturing and technology services provider increases chip-on-wafer (CoW) yield by 3.3% from 96.47% to 99.66%. Download now. Nordson Electronics Solution Jun 6, 2024 CMP Carrier Head Film Replacement Testing Semiconductor manufacturing relies on precise processes like CMP. With Pureon DF200 discontinued, Entrepix explores alternatives. Testing PR Hoffman 1000, PR Hoffman 7000, Pureon PF800 films shows promise. Entrepix May 20, 2024 Space-Proofing Power: CoolCAD's Mission to Radiation-Harden Power Semiconductor Devices This paper addresses radiation-induced failures in power semiconductor devices for space applications and outlines NASA's technology roadmap objectives for power and energy storage in space, highlighting areas needing advancement. CoolCAD Electronics LLC May 10, 2024 Does Water Do the Job on Its Own? Matching a cleaning agent to the soil it cleans is key because cleaning only with deionized water may not always be effective when cleaning electronics. Download to learn more. Kyzen Corporation |
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