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Jul 29, 2022 The Great Debate: Ball Bonding vs Wedge Bonding Over the years, microelectronic wire bond process and packaging engineers have debated whether to use ball or wedge bond technologies. ... Palomar Technologies, Inc. Jul 20, 2022 Chip-Last HDFO Interposer-PoP This paper will discuss package-level characterizations on the interposer-PoP with HDFO RDL routing layer, package z-height evaluation, temperature-dependent package ... ... Amkor Technology, Inc. Jun 30, 2022 Air Gap, Buried Layer and Micro-Channel Measurement Air Gap thickness, the vertical distance of two planes or the depth of a capped microfluidic channel are important parameters ... cyberTECHNOLOGIES Jun 24, 2022 Essential Practices for Gold Mitigation of Electronic Components The ideal method to facilitate the repeatable and reliable removal of gold plating from electronic components is to use a ... Circuit Technology Center Jun 14, 2022 Die-to-Wafer Bonding Key to Enabling Heterogeneous Integration Die-to-Wafer (D2W) hybrid bonding is an enabling process to accelerate the deployment of 3D/heterogeneous integration and bring about new generations ... EV Group Jun 2, 2022 The Journey to Full-Scale Semiconductor Packaging Manufacturing The challenges faced from package design and prototyping, through process development and process optimization are presented to ensure the device ... Palomar Technologies May 24, 2022 Dispositioning Hermetic Microelectronic Components With High Internal Moisture This white paper presents four options for dispositioning hermetic electronic components non-compliant on internal water vapor content. ... Robert K. Lowry, Electronic Materials Consultant May 10, 2022 Automated Wafer TTV & Shape Metrology Wafer thickness, TTV, flatness and warpage are important parameters to be monitored for wafer production as well as device processing. ... cyberTECHNOLOGIES May 2, 2022 Empowering RF Front End Cellular Innovations with DSMBGA With the introduction of 5G, cellular frequency bands have increased considerably, requiring innovative solutions for the packaging of RF front-end ... Amkor Technology, Inc. Apr 22, 2022 Diamond's thermal management properties are enabling higher performance solutions A long-standing research collaboration between University of Bristol and Element Six is accelerating diamond's path towards unlocking highly ... ... Element Six |
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