Technical Papers Index
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476 technical papers.

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Sep 30, 2024
Determining Chemistry Compatibility and Solubility Comparison for Cu Pillar Flip Chip Cleaning
Evaluating appropriate chemistries to remove WS Flux residues and refining cleaning processes can meet challenges associated with producing Cu Pillar ...
KYZEN

Sep 23, 2024
Enabling A Chiplet Supply Chain
Chiplet-based architectures are on the rise, offering smaller die sizes and improved yields over large SoCs. Despite benefits in cost ...
Amkor Technology, Inc.

Sep 16, 2024
Incorporating EOTPR in Chip-Level Failure Analysis Workflow: Case Studies
The paper showcases six failure analysis case studies comparing TeraView’s Electro Optical Terahertz Time Reflectometry (EOTPR) with other electrical fault ...
TeraView

Sep 5, 2024
Detecting Wafer Level Cu Pillar Defects Using 3D X-ray Microscopy (XRM) with Submicron Resolution
Two case studies show how advanced high-resolution 3D XRM can detect and visualize defects in Wafer Level Chip Scale Packages ...
ZEISS

Aug 28, 2024
US Microelectronics Packaging Ecosystem: Challenges and Opportunities
Analyzing The U.S. Advanced Packaging Ecosystem With Countermeasures To Mitigate Hardware Security Issues by strengthening domestic advanced packaging capabilities.  ...
University of Florida

Aug 21, 2024
A Hybrid PLP Technology Based On A 650 X 650 mm Platform
A novel panel-level packaging technology, Hybrid PLP, reduces costs by enabling the processing of multiple wafers on a large 650mm ...
Amkor Technology, Inc.

Aug 14, 2024
Large Area Sintering (Half-Bridge Modules) in Power Electronics
Process allows dispensing of over 100 mm² for large-area sintering applications, improving competitiveness and sustainability in e-mobility and power electronics ...
Tresky GmbH

Aug 7, 2024
A versatile stepper tool designed to address the challenges of diverse device processes
This paper highlights several unique features of the stepper tool. Not only its satisfactory resolution and competitive throughput, the "PPS-8000" ...
ORC Manufacturing CO., LTD

Jul 31, 2024
Advanced Packaging for Next-Generation Vehicle
Automotive processors are swiftly adopting advanced semiconductor technologies, including 5 nm and 3 nm processes. This shift necessitates advanced packaging ...
Amkor Technology, Inc.

Jul 24, 2024
The Role of Solder in Advanced Semiconductor Packaging
Here we cover various packaging technologies and methods, including how solder products are integrated into these processes, while shedding light ...
AIM Solder

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