Sponsor

Packaging Solutions for Unique Markets
The MLF/QFN packaging technology is the fastest-growing IC packaging solution today. MLF/QFN packaging solutions represent a >111B-unit market across five unique markets.
Amkor Technology, Inc.

Technical Paper

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

A universal AI & Deep Learning powered model that enhances defect detection in AOI systems for PCBAs and semiconductors, further improving accuracy, speed and consistency - streamlining inspection processes.
Nordson Test & Inspection

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Sponsor

Contamination Control
Balazs™ provides technical expertise in identifying and controlling Airborne Molecular Contamination (AMC) and Surface Molecular Contamination (SMC) for improving process and product yields.
Balazs Nanoanalysis