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2026 IEEE ECTC – May 26-29 in Orlando
The Electronic Components & Technology Conference delivers the best in packaging, components & microelectronic technologies, held at the JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, FL.
ECTC

Technical Paper

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

A universal AI & Deep Learning powered model that enhances defect detection in AOI systems for PCBAs and semiconductors, further improving accuracy, speed and consistency - streamlining inspection processes.
Nordson Test & Inspection

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More Technical Papers

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Full Technical Paper List

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Hermetic Microelectronic Package Seam Seal
Technical paper on technology that delivers a pristine internal atmosphere for hi-rel microelectronic components. Process automation, including AI, and standard tooling utilized in die and wire bonding is standard.
MicroCircuit Laboratories, LLC