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Tresky

Motivation for pressure-assisted metallic sintering in Power Electronics
Paper provides an understanding of motivations and practical implications of pressure-assisted metallic sintering for power electronics.
Tresky Automation
SEIKA-America
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Circuit-Technology-Center

Tech Paper - Keys to Component Lead Tinning Success
This paper examines the challenges and best practices of component tinning, with a focus on temperature control, flux selection, and soldering techniques.
Circuit Technology Center
Balazs-Nanoanalysis