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Temporary Bonding Materials
Boost throughput and quality with Brewer Science's BrewerBOND® VersaLayer temporary bonding system for high-temperature (400˚C) and high-stress applications.
Brewer Science

Technical Paper

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

A universal AI & Deep Learning powered model that enhances defect detection in AOI systems for PCBAs and semiconductors, further improving accuracy, speed and consistency - streamlining inspection processes.
Nordson Test & Inspection

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Ultrasonic Bonding in semiconductor industry - The fast and clean process
Ultrasonic die bonding enhances semiconductor assembly with strong bonds, reduced thermal stress, and advancements in 3D packaging technology.
Tresky