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Aug 22, 2017
SEMI Foundation Celebrates New York United Teachers, Recognizes Volunteers of the Year
The SEMI Foundation today announced that it will be celebrating its 10th anniversary of partnership with New York State United Teachers (NYSUT) on August 22-23 in Latham ...
SEMI
Aug 22, 2017
ZESTRON Americas Announces New Regional Sales Manager
ZESTRON is pleased to announce the addition of Nick Iwata as the new Western Regional Sales Manager. "Mr. Iwata is an excellent addition to our global team," says Sal Sparacino ...
ZESTRON
Aug 21, 2017
iMAPS is 2 months away - visit YINCAE booth 416
IMAPS New England 50th Symposium & Expo is 2 months away! The tradeshow will take place at Raleigh Convention Center in Raleigh, North Carolina, on October 10th and 11th ...
YINCAE Advanced Materials, LLC
Aug 21, 2017
Marty Daniel Joins StratEdge as Account Manager
StratEdge Corporation announces the selection of Marshall "Marty" Daniel as its new account manager. Ms. Daniel will drive new business development and customer relations ..
StratEdge Corporation
Aug 18, 2017
Stamped Spring Pin Socket for SOT23
Ironwood Electronics recently introduced a new socket addressing high performance requirements for Burn-in and Test applications - CBT-SO-4006. The contactor ...
Ironwood Electronics
Aug 18, 2017
New Dry Film Negative Photoresist for MEMS and Wafer Level Packaging
Engineered Material Systems, Inc. is pleased to introduce the DF-3590 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer level packaging ...
Engineered Material Systems, Inc.
Aug 18, 2017
High Reliability & High Temperature Application Solution -- Solder Joint Encapsulant Paste
Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology -- solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International ...
YINCAE Advanced Materials
Aug 17, 2017
KLA-Tencor Announces New FlashScan Product Line for Inspection of Optical and EUV Reticle Blanks
KLA-Tencor Corporation announced the new FlashScan™ reticle blank* inspection product line. While KLA-Tencor has been a major presence in patterned reticle ...
KLA-Tencor
Aug 17, 2017
Automated Thickness Measurement System Speeds Production
The labor-intensive, manual process of recording precise measurements across various wafer coordinates is now programmable for automated data collection and report ...
Acu-Gage Systems
Aug 17, 2017
High Reliability & High Throughput Ball Bumping Process Solution -- Solder Joint Encapsulant Adhesive
Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology -- solder joint encapsulant adhesives for ball bumping, at the 2017 International Symposium ...
YINCAE Advanced Materials