We search for industry news, so you don't need to.
News | Search | Subscribe
Press Releases arrow   Page 1 of 418   arrow
Submit a Press Release
Jun 23, 2017
Exploring Smart Sensor Explosive Growth at SEMICON West 2017
MEMS & Sensors Industry Group® (MSIG), the industry association advancing MEMS and sensors across global markets, today announced its line-up of speakers for TechXPOT ...
SEMI
Jun 23, 2017
Power IC: Yole proposes consolidated tracking market data
The power IC market revenue will reach US$18 billion in the year 2022, announces Yole. In its new global market research database titled, Power Integrated Circuit 2017...
Yole Développement
Jun 23, 2017
Leti Sigmafusion Solution for Autonomous Vehicles Embedded in Aurix Platform of Infineon
Leti announced that Leti's embedded sensor fusion solution, SigmaFusion, has been embedded in Infineon Technologies' AURIXTM TC29x platform. This platform enables ...
Leti
Jun 23, 2017
GORE® PHASEFLEX® Microwave/RF Test Assemblies Selected By Rohde & Schwarz
Gore has announced that Rohde & Schwarz (R&S) is endorsing GORE® PHASEFLEX® Microwave/RF Test Assemblies for use with its new R&S ZNBT20 multi-port VNA. The new R&S ...
W. L. Gore & Associates Inc.
Jun 22, 2017
SEMI Europe Applauds New Semiconductor Manufacturing Investment
SEMI Europe commended the announcement of a new electronics manufacturing facility in Dresden, Germany and the supporting public policy to reinvigorate regional ...
SEMI
Jun 22, 2017
75GHz Clamshell Socket for NXP's FCPBGA
Ironwood Electronics has recently introduced a new BGA socket design using high performance elastomer capable of 75GHz, very low inductance and wide temperature applications. ...
Ironwood Electronics
Jun 22, 2017
MicroAssembly Tech presents the new Crossover, Model 6200 Table-Top Die Attach System, at Semicon West
MicroAssembly Technologies (MAT) is proud to present for the first time in the USA the new Crossover, Model 6200, Die Attach System. The Crossover is a state of the art ...
MicroAssembly Technologies, Ltd.
Jun 21, 2017
Advanced packaging brings more value and cost reduction to future semiconductor products
Yole confirms the consolidation of the advanced packaging industry, that is showing a steady growth between 2016 and 2022 in revenue. Advanced packaging is showing ...
Yole Développement
Jun 21, 2017
North American Semiconductor Equipment Industry Posts May 2017 Billings
North America-based manufacturers of semiconductor equipment posted $2.27 billion in billings worldwide in May 2017 (three-month average basis), according to the May ...
SEMI
Jun 21, 2017
Presto Engineering Launches New Image Sensor Turnkey Services
Presto Engineering Inc. now offers a turnkey industrialization service for image sensors. The industry has experienced an increase in demand for these sensors, which are ...
Presto Engineering