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Oct 15, 2019
2019 Edition of the Heterogeneous Integration Roadmap
IEEE announced the 2019 release of the Heterogeneous Integration Roadmap (HIR), a roadmap to the future of electronics identifying technology requirements ...
TechSearch International

Oct 15, 2019
APPLAUSE focuses on developing advanced packaging for photonics, optics and electronics
A consortium of 31 European electronics packaging, optics and photonics key players, leading equipment suppliers and testing experts launched a new project, "Advanced ...
APPLAUSE

Oct 15, 2019
PROPHESEE Joins IRT Nanoelec 3D Integration Program
PROPHESEE joins the IRT Nanoelec consortium to help broaden the field of potential applications for 3D hybrid wafer-to-wafer bonding with fine interconnect pitches. ...
IRT-Nanoelec Research Technological Institute (IRT)

Oct 14, 2019
ZESTRON Academy to Host FREE 'Multiple Thermal Cycles' Webinar
ZESTRON is pleased to announce that it will host "Multiple Thermal Cycles" on Thursday October 24th, from 1:30 PM to 2:30 PM EDT. This is the final installment ...
ZESTRON

Oct 14, 2019
Thermally Conductive, Electrically Insulative Potting Compound Resists High Temperatures
Master Bond Supreme 121AO is a NASA low outgassing approved epoxy suitable for bonding, sealing and potting applications. Featuring a high glass transition temperature ...
Master Bond

Oct 14, 2019
Mycronic receives order for two Prexision Lite 8 Evo mask writers
Mycronic AB (publ) has received an order for Prexision-series mask writers for display applications from Photronics Inc, for deployment in Asia. The order consists of ...
Mycronic AB

Oct 10, 2019
Spring Pin Socket for Optical Engine
Ironwood Electronics recently introduced a new LGA socket addressing high performance requirements for 1mm pitch Optical Engine - CBT-LGA-5019. The contactor is stamped ...
Ironwood Electronics

Oct 10, 2019
Imec extends Silicon Photonics portfolio targeting next-generation data center interconnects
At the 45th European Conference on Optical Communication (ECOC), imec, together with IDLab and the Photonics Research Group, both imec research labs at Ghent University ...
imec

Oct 10, 2019
CML removes barriers to wider use of AIS, increasing maritime safety for more sea vessels
CML Microcircuits is pleased to introduce the SCT7033, the industry's first AIS Class B processor to include the full protocol stack already embedded within the device. This ...
CML Microcircuits

Oct 9, 2019
CIS industry: What is behind the growth of Q2 2019
"Q2 2019 has exceeded our expectations, with+7% but there is little good news beyond mobile," announces Pierre Cambou, Principal Analyst, Imaging at Yole Développement. ...
Yole Développement

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