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Jan 20, 2017
TechSearch International Analysis Predicts Growth for Fan-in and FO-WLP
TechSearch International predicts strong market growth for fan-in wafer level packages (WLPs) and fanout WLP (FO-WLP). Driven by demand for thin, low-profile ...
TechSearch International
Jan 20, 2017
Libra Industries Supports the Pan Pacific Microelectronics Symposium
Libra Industries is pleased to announce that it is a corporate sponsor of the 2017 Pan Pacific Microelectronics Symposium. The event is scheduled to take place ...
Libra Industries
Jan 20, 2017
Microtronic GmbH Signs on Vector Quality Group as Its Newest Representative
Microtronic GmbH is pleased to announce that it has appointed Mr. Catalin Grigorescu with Vector Quality Group as its representative. Grigorescu will represent ...
Microtronic GmbH
Jan 19, 2017
Industry Veteran Nick Leonardi Joins SMART Microsystems Team
Nicholas Leonardi has been retained by SMART Microsystems in the role of Business Development, bringing over 25 years of industry experience with positions ranging ...
SMART Microsystems
Jan 19, 2017
Chip Size 1.27mm Pitch Socket Adapter for BGA452
Ironwood Electronics' new high performance socket adapter - SF-BGA452A-B-32F allows 1.27mm pitch, 35x35mm body, 26X26 array IC to be placed in socket and operated ...
Ironwood Electronics
Jan 18, 2017
Amkor Discussion on Five Industry-Leading Packaging Technologies Featured in MEPTEC Report
In the recently released Winter 2015 issue of MEPTEC Report, Amkor packaging experts Ron Huemoeller (Corp. VP, R&D), Adrian Arcedera (VP, MEMS & Sensors) and Rama ...
Amkor Technology, Inc.
Jan 17, 2017
IoT Breakthrough: Nano Dimension Combines Rigid PCB and Flexible Connectors in Single 3D Print
Nano Dimension Ltd. announced today that its wholly owned subsidiary, Nano Dimension Technologies Ltd., has successfully 3D printed a series of multi-layered ...
Nano Dimension Ltd.
Jan 17, 2017
Akrometrix Announces First Shipment of FOWLP Panel Warpage Metrology System
Akrometrix, LLC announced the shipment of its first warpage metrology system specifically designed for FOWLP Panel applications -- the AKM600P ...
Akrometrix, LLC
Jan 13, 2017
TSMC Collaborates With Mentor Graphics
Mentor Graphics Corp. announced that TSMC has extended its collaboration with Mentor Graphics on the Xpedition® Enterprise platform in conjunction with the Calibre® ...
Mentor Graphics Corp.
Jan 13, 2017
Meyer Burger receives order for DW 288 Series 3 diamond wire cutting technology
An existing PV customer located in Europe has awarded Meyer Burger a contract for about CHF 8 million for the delivery and installation ...
Meyer Burger Technology Ltd