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Jan 26, 2026 Intel May License Super MIM to UMC, Boosting AI & Advanced Packaging Capability Intel and UMC are exploring a deeper AI-focused partnership, with Intel potentially licensing its Super MIM capacitor tech to UMC. This high-density, low-leakage technology could boost UMC's advanced packaging & power modules, enabling AI accelerators & high-performance computing. TrendForce Jan 26, 2026 VIEWPOINT 2026: Michael Dube, Executive Vice President of Manufacturing Operations, Rochester Electronics In 2025, Rochester Electronics continued to scale U.S. manufacturing to meet rising demand for long-life-cycle semiconductor support. As a trusted U.S. partner, we provide turnkey solutions including design, die processing, assembly, packaging, and testing for automotive, industrial, medical, and military markets. ... Rochester Electronics Jan 26, 2026 Chip Industry Week In Review TSMC plans to cut Fab 14 mature-node capacity 15–20% to shift resources to advanced packaging, leaning on its VIS site in Singapore and overseas fabs to serve legacy nodes, as memory markets tighten amid tariff threats, DRAM shortages, and HBM. Semiconductor Engineering Jan 26, 2026 Nvidia CEO tours Shanghai amid fresh signs of China thaw Nvidia CEO Jensen Huang began a China visit in Shanghai, touring the company's local office and even stopping at a busy Lujiazui grocery market. His trip comes as Beijing is expected to allow imports of Nvidia's H200 AI chips soon there. South China Morning Post Jan 26, 2026 The 'silicon shield' not everything in defense An op-ed warns Trump may abandon Taiwan, citing tariffs and US chip reshoring. Critics say it misreads TSMC: overseas fabs boost resilience while core R&D stays in Taiwan. Security rests on broader Indo-Pacific stakes, not a fading "silicon shield." Taipei Times Jan 26, 2026 Pegatron eyes AI revenue Pegatron expects triple-digit growth in AI server revenue this year as demand surges. It is expanding beyond Nvidia GPU servers into inference and ASIC systems, scaling with major CSPs, adding advanced integration and cooling, and ramping plants in Mexico, Texas, and Taiwan. Taipei Times Jan 26, 2026 Intel shares tumble amid manufacturing issues Intel shares slid up to 14% after CEO Lip-Bu Tan warned manufacturing yields remain weak and forecast revenue and EPS well below estimates. Production snags, depleted inventory and delayed server chip supply dim hopes for a quick turnaround. Taipei Times Jan 26, 2026 As Demand for Fast AI Tokens Grows, D-Matrix Develops Fast NIC D-Matrix is betting on fast, low-latency LLM token generation as inference scales. Its Corsair accelerators, 3D-stacked memory, and Jetstream NICs target bandwidth limits, enabling heterogeneous, scale-out AI inference for agents and SLMs now. EE Times Jan 26, 2026 Intel stock drops 17%, its worst day since 2024, as manufacturing troubles overshadow earnings beat Intel shares sank 17% after weak guidance and a supply warning, marking their worst day since August 2024. CEO Lip-Bu Tan said yields lag targets and demand can’t be met, while revenue and EPS outlook missed expectations despite a Q4 beat solid. CNBC Jan 26, 2026 Nvidia's Huang to visit China as AI chip sales stall Nvidia CEO Jensen Huang plans a China visit ahead of Lunar New Year, meeting buyers and staff as U.S. export curbs squeeze sales. With China once a fifth of data-center revenue, Huang will address supply hurdles for approved AI chips amid scrutiny. CNBC |
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