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May 8, 2026 TSMC to Build 9 New Plants this Year to Boost Global Footprint TSMC expands globally, building nine new plants this year across Taiwan, US, Japan, and Germany. It advances 3nm, 2nm, and 1.4nm fabs while boosting AI-driven advanced packaging capacity to support high-performance computing and semiconductor demand growth. Taiwan News May 8, 2026 2.5D + 3D = "3.5D"! Semiconductor firms are moving beyond Moore's law with 3.5D integration, blending 2.5D and 3D packaging to accelerate AI performance. The hybrid approach boosts bandwidth and efficiency while managing cost, yield, and thermal tradeoffs through selective stacking. Semiconductor Engineering May 8, 2026 GlobalFoundries Reportedly Sees Silicon Photonics Revenue Doubling in 2026, Passing $1B by 2028 GlobalFoundries is accelerating silicon photonics growth as AI networking demand boosts pluggable and co-packaged optics. GF expects photonics revenue to double in 2026, exceed $1 billion by 2028, and drive stronger pricing in constrained markets. TrendForce May 8, 2026 SKC Said to Speed Glass Substrate Mass Production by Year-End; Advances New Non-Embedding Tech for U.S. Client SKC and Absolics are nearing what could become the world's first commercial glass substrate production, advancing advanced packaging for AI and communications chips. AMD, AWS, Apple, Intel, and Samsung links highlight rising industry momentum. TrendForce May 8, 2026 Nvidia CEO says AI partnership with Corning will 'revitalize American manufacturing' Nvidia CEO Jensen Huang highlighted a partnership with Corning to expand U.S. optical connectivity manufacturing, calling AI infrastructure the largest buildout in history. The deal boosts domestic supply chains, creates jobs & advances silicon photonics for future data centers. CNBC May 8, 2026 Nvidia inks US$500 million deal with fiber-optic maker Corning Nvidia buys $500 million in Corning shares to deepen an AI infrastructure partnership. Corning will boost US fiber capacity over 50% with new plants, while both firms expand high-speed optical networks powering AI data centers and chips. Taipei Times May 8, 2026 MediaTek launches AI data center MediaTek launches a 45MW AI data center in Miaoli to boost chip R&D, completing a 15MW first phase. Powered by Nvidia B200 chips and immersion cooling, it processes 138B tokens monthly despite component shortages, with expansion planned. Taipei Times May 8, 2026 Stacking 2D materials on bulk semiconductors yields smarter, faster photodetectors A review shows 2D/3D van der Waals heterostructures combine atomically thin materials with bulk semiconductors to build faster photodetectors and neuromorphic vision systems while overcoming interface, band engineering and fabrication challenges. Nanowerk May 8, 2026 The Emergence Of Electronics Digital Twins For Software-Defined Vehicles Electronics digital twins expand traditional twin models to simulate entire electronics and software systems in software-defined vehicles, accelerating AI-driven validation, cutting costs, enabling continuous updates, and improving safety across automotive and industrial ecosystems. Semiconductor Engineering May 8, 2026 Securing Chiplet-Based Platforms: Distributed Trust With Centralized Authority In chiplet architectures, security shifts from monolithic SoC trust to platform-level governance. A Main Security Chiplet enforces centralized trust decisions, while lightweight roots of trust in each chiplet enable identity, secure boot, communication, and lifecycle protection across the system. Semiconductor Engineering |
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