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Mar 6, 2026 3D Stack: Mastering ESD Verification In Advanced Semiconductor Design Electrostatic discharge (ESD) verification plays a critical role in protecting semiconductor designs from sudden failure. As chips move into complex 3D stacks, engineers must adopt advanced verification techniques to manage rising design complexity and prevent electrostatic damage. Semiconductor Engineering Mar 6, 2026 VIEWPOINT 2026: Tom Solon, P.E., Director of Sales, RH Murphy Co. 2025 was a good year for RH Murphy Company and we look forward with guarded optimism to 2026. New automation equipment and staff are being added to support growth and customer needs. Demand for JEDEC matrix trays, waffle pack chip trays, test carriers and custom ESD trays grow steadily along with the connectivity ... RH Murphy Co. Mar 6, 2026 Intel CFO sees strong AI server chip demand Intel CFO Dave Zinsner said strong demand for server processors—driven by booming AI infrastructure—continues to outpace supply. Factory and industrywide chip shortages keep Intel running above capacity, though constraints should gradually ease while growth persists this year. Tech in Asia Mar 6, 2026 Memory squeeze to continue into next year: Adata Adata Technology expects memory chip supply constraints to persist into next year, driving further DRAM and NAND price gains. Rising AI-driven demand for enterprise SSDs and low vendor inventories tighten supply, boosting Adata's sales and revenue outlook. Taipei Times Mar 6, 2026 At MWC, Intel Outlines CPU-Driven Case for Telecom Networks Intel unveiled its Xeon 6 platform at MWC 2026, promoting CPUs with built-in AI acceleration as a cost- and energy-efficient alternative. The chip consolidates RAN, core, and AI inference workloads, helping operators simplify hardware and reduce power consumption. EE Times Mar 6, 2026 Top chip leaders urge national drive to 'build China's ASML' amid US curbs China's semiconductor leaders urge a national effort to build a domestic alternative to ASML's EUV lithography systems, warning US sanctions expose weaknesses in China's fragmented chip sector & calling for coordinated investment, consolidation & technology development before 2030. South China Morning Post Mar 6, 2026 Power, Not Area: Why Edge GPU Design Is Entering A New Era Semiconductor scaling below 2nm is shifting GPU design priorities from transistor density to heat and power management. Rising thermal density forces lower voltages and frequencies, pushing architects toward energy-efficient parallelism, and selective chiplet use. Semiconductor Engineering Mar 6, 2026 Auto Security Accelerates With Standardization And Certified Silicon Automakers are strengthening cybersecurity as software-defined vehicles grow more connected. New standards, encrypted networks and secure chips are reshaping design while automakers and chip firms work together to protect vehicle systems, data and passengers. Semiconductor Engineering Mar 6, 2026 The New Design Advantage: Why Unifying Processing And Connectivity Simplifies The Design Experience Mixed-signal advances integrate wireless connectivity and microcontrollers on a single chip, simplifying system design while reducing power use and size. The approach accelerates development, strengthens IoT connectivity, and enables efficient, reliable AI-ready devices. Semiconductor Engineering Mar 6, 2026 Exclusive: Allen Wu on Disrupting $100M Cost of Building Custom AI Chips Allen Wu, founder of CoreLab Technology, aims to slash the $100 million cost of designing AI chips by building an open, modular compute platform using RISC‑V International and mixed architectures, enabling customizable processors for robotics and emerging physical AI workloads. EE Times |
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