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Jun 8, 2026 Glass Substrates Eye 2027 Launch, Scale Toward 2030 as CoWoS Costs Rise and Hyperscaler Demand Grows Glass substrates gain momentum for AI chip packaging as commercialization targets 2027–2030, driven by NVIDIA and Google demand. TSMC, Intel, SKC, Samsung and LG advance pilot lines as CoWoS costs rise and density, power efficiency improve. TrendForce Jun 8, 2026 Global Semiconductor Sales Increase 11% Month-to-Month in April SIA reports global semiconductor sales hit $110.5B in April 2026, rising 11% month over month and 93.9% year over year, marking 14 straight months of growth. It backs a WSTS forecast projecting $1.5T in 2026 and $1.9T in 2027 driven by AI demand. Semiconductor Industry Association Jun 8, 2026 Chinese memory firms edge closer to challenging Korea's chip giants China's leading memory chipmakers CXMT and YMTC advance toward IPOs while rapidly expanding output and market share, signaling stronger competition for Samsung and SK hynix as AI-driven demand fuels growth and Chinese firms close the technology gap in mature segments. The Korea Times Jun 8, 2026 Geopolitics, AI, and Jensen Huang Fuel Electronics' Rock-and-Roll Era At Computex 2026 in Taipei, crowds treated Nvidia CEO Jensen Huang like a rock star as he showcased RTX Spark and AI advances. The event highlighted booming interest in GPUs, robotics, and agentic AI across Taiwan's full-stack semiconductor ecosystem. EE Times Jun 8, 2026 Nvidia to expand capacity through next year: CEO Nvidia CEO Jensen Huang said the company will double capacity in the second half of this year to meet surging AI demand, warning supply chains remain tight. He predicted next year will far exceed current production levels. Taipei Times Jun 8, 2026 Huawei chips refine DeepSeek model in major leap for China's AI self-reliance Researchers, including Huawei, used Ascend 910C chips to complete full-parameter post-training of DeepSeek-V4-Pro on a 1.6 trillion-parameter model across a 1,000-chip cluster, advancing China's AI capabilities from inference to large-scale model training despite U.S. chip restrictions. South China Morning Post Jun 8, 2026 Tencent's chief AI scientist dismisses lag concerns, says race a 'long-term game' Former OpenAI researcher Yao Shunyu says the AI race is just beginning, with coding agents and embodied intelligence poised to create trillion-dollar markets. He argues success will depend on infrastructure, data quality, and long-term investment. South China Morning Post Jun 8, 2026 Chip Industry Week In Review Arm and Nvidia launched RTX Spark AI with Grace CPU and Blackwell RTX GPU. Cadence introduced an AI engineer. Intel unveiled Xeon 6+ on 18A with partnerships, while firms showcased CPO, Micron SOCAMM2 and Samsung HBM5 advances. Semiconductor Engineering Jun 8, 2026 Packaging Technologies Redefine AI And HPC Scalability Limits At ECTC 2026 Intel Foundry showcased EMIB-T, co-packaged optics and glass substrates at the 2026 IEEE ECTC, advancing AI and HPC scaling. The technologies boost bandwidth, cut power consumption and enable multi-die chiplet architectures that surpass reticle-size limits. Semiconductor Engineering Jun 8, 2026 Chips Act 2.0 Puts Demand at Center of Europe's Semiconductor Strategy The European Commission's Chips Act 2.0 shifts from supply-side semiconductor subsidies to a demand-driven strategy, boosting AI chip design, aligning production with market needs, closing scale-up funding gaps, and strengthening Europe's fragmented chip ecosystem. EE Times |
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