| News Index | ||
|
||
|
|
||
|
Jul 8, 2026 Inspection And Metrology Catching Up For High-Density Fan-Out Panel Packaging Rising AI and HPC demand is accelerating panel-level packaging adoption, forcing chip manufacturers to upgrade inspection and metrology systems. Shrinking features, higher layer counts, and larger panel sizes require advanced defect detection, 3D measurement, and warpage control to maintain yield and reliability. Semiconductor Engineering Jul 8, 2026 World working together ‘as one ecosystem’ on RISC-V chip research: executive Alibaba vice-president Qi Xiaoning said global collaboration on the open-standard RISC-V chip architecture remains strong despite US-China tensions. He highlighted Alibaba’s RISC-V advances, praised international cooperation, and said Hong Kong could become a key hub for chip design and future RISC-V events. South China Morning Post Jul 8, 2026 Chinese Team Achieved Major Breakthrough in Carbon Nanotube CFET Architecture Researchers at Peking University developed the first all-carbon nanotube CFET digital logic circuits, marking a major advance toward ultra-low-power, high-performance chips that could accelerate next-generation AI, edge computing, and semiconductor scaling beyond silicon. TrendForce Jul 8, 2026 Chinese Firms Reportedly Raise Domestic AI Chip Budget Share from 30% to 46% Amid Shift from NVIDIA Chinese companies are increasing domestic AI chip spending from 30% to 46% of their budgets, accelerating the shift away from Nvidia as export restrictions, government support, and stronger local semiconductor suppliers drive greater adoption of homegrown AI hardware. TrendForce Jul 8, 2026 New DRAM Price-Fixing Case Against Samsung, SK hynix, and Micron Tests Whether HBM Expansion Can Prove Collusion A new U.S. lawsuit accuses Samsung, SK hynix, and Micron of restricting DRAM supply under the guise of expanding HBM production for AI, testing whether market shifts can provide evidence of unlawful price-fixing and collusion. TrendForce Jul 8, 2026 Micron and Ford Sign Strategic Agreement to Strengthen Long-Term Memory Supply and Industry Resilience Micron and Ford signed a long-term strategic agreement to secure automotive memory and storage supplies for next-generation vehicles. Micron will expand U.S. production, including advanced DRAM manufacturing in Virginia, strengthening supply chain resilience and supporting growing demand for intelligent vehicles. 3DInCites Jul 8, 2026 Advantech posts record revenue in second quarter Advantech posted record second-quarter revenue as rising edge AI demand fueled strong global sales despite supply chain pressures. Quanta also achieved record quarterly revenue, driven by robust AI server shipments, and expects to double AI-related revenue this year while expanding its server business. Taipei Times Jul 8, 2026 Samsung results trigger stock rotation Asian tech stocks fell as investors locked in profits despite Samsung’s blockbuster earnings, reflecting growing caution over AI-driven chip valuations. Money rotated into defensive sectors while markets awaited upcoming results from TSMC and other semiconductor leaders amid persistent geopolitical concerns. Taipei Times Jul 8, 2026 Photoluminescence Inspection Is Changing How Manufacturers Protect Yield In SiC And GaN Devices Power semiconductor manufacturers are adopting advanced photoluminescence inspection and electrical metrology to detect critical SiC and GaN wafer defects, improve yield, and ensure reliability as the industry transitions to larger wafers for high-voltage, high-performance power devices. Semiconductor Engineering Jul 8, 2026 Multi-die Testing In The Field Must Build On Established Test Methodologies AI-driven multi-chip systems are outgrowing traditional testing methods, accelerating demand for in-system testing, predictive analytics, and high-speed interfaces such as PCIe to detect, isolate, and repair failures throughout a chip’s lifecycle, improving reliability in AI, automotive, and data center applications. Semiconductor Engineering |
|
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Insert Your Email Address |