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Two Component, Thermally Conductive Epoxy
Master Bond EP21AOLV-1 is a thermally conductive, electrically isolating adhesive featuring a low CTE, excellent dimensional stability, and high compressive strength.
Master Bond
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Two Component, Thermally Conductive Epoxy
Master Bond EP21AOLV-1 is a thermally conductive, electrically isolating adhesive featuring a low CTE, excellent dimensional stability, and high compressive strength.
Master Bond
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Epoxy & Adhesive DIE Bonding
One of the most common methods of creating a connection between chip and substrate is the gluing process. Extreme precise epoxy & adhesive bonding processes for sustainable bonds.
Tresky Automation
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