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AEC Grade-0 and MSL Level-1 Conductive Paste & Film Adhesives
240° Tg and ultra-high thermal stability for AEC Grade-0 applications. Proven rapid and snap curing die-attach paste for ultimate productivity.
AI Technology, Inc.

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Ultrasonic Bonding: Cohesive connection between a chip & substrate
Electrically conductive and mechanical bonds for temp-sensitive components or components that are difficult to heat with Ultrasonic Bonding.
Tresky Automation