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Dicing Die-Attach Film (DDAF) or Dicing Die-Attach Tape (DDAT)
AI Technology pioneered the use of flexible die-attach film and paste adhesives for larger chip and die bonding. We now have extended our adhesive line. See more
A.I. Technology, Inc.

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Plasma Treatment during FOWLP Optimizes Performance and Costs
Fan-out Wafer-Level (FOWLP) & Fan-out Panel-Level (FOPLP) benefit from plasma treatment, which ensures surfaces are contamination-free. Read more
Nordson Electronics Solutions