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Viewpoint Index
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Jan 19, 2026
VIEWPOINT 2026: Eelco Bergman, Chief Business Officer, Saras Micro Devices
As we move into 2026, the demand for high-performance compute devices, especially for AI data centers, remains robust; however, the benefit of these devices on system performance is increasingly constrained by power delivery rather than transistor capability. Yole reported that the total addressable market (TAM) ...
Jan 16, 2026
VIEWPOINT 2026: José Manuel Ramos, CEO, Wooptix
Many important developments and investments in chip manufacturing have come about over the past year, and the chase is on to increase chip performance by packing more layers inside. That places more attention on metrology for defect detection. Consequently, I'm very optimistic about the industry's outlook ...
Jan 15, 2026
VIEWPOINT 2026: Anika Baumhauer, International Strategy & Sales Manager, SONOTEC GmbH
In 2025, we worked diligently on our vision 2030. Outlining our corporate strategy gives us a clear picture of our goals and how to achieve them. In 2026, our focus will be on product development, expanding strategic markets, and continuous growth. We will invest heavily in our non-contact flow meter ...
Jan 14, 2026
VIEWPOINT 2026: Nitin Parekh, CEO, Via Automation
In today's semiconductor industrial landscape, downtime is more costly than ever. Unplanned machine downtime cost manufacturers more than $1.5 trillion globally per year. The cost of a single hour of downtime has surged by 50% in just two years. Similarly, semiconductor manufacturing is inefficient ...
Jan 13, 2026
VIEWPOINT 2026: Isabella Drolz, Global Head Division IXS, VP Commercial, Comet
In the semiconductor industry, the zero-defect approach demands consistent quality management along the process development and production chain. Comet provides high-tech X-ray inspection solutions for crucial production phases, such as TSV filling in wafer processing or die attach in chip-level bonding. ...
Jan 12, 2026
VIEWPOINT 2026: Ken Kuang, President and Founder, Torrey Hills Technologies, LLC
The rapid use of AI is forcing engineers to totally rethink how we build chips. The modern design is no longer just about the silicon chip; it's about the complex package where electrical signals and light-based optical signals meet. New technologies like Co-Packaged Optics (CPO) and high-speed pluggable modules ...
Jan 9, 2026
VIEWPOINT 2026: Andy Behr, Technology Manager, Panasonic Electronic Materials
The IC packaging industry is undergoing a transformative shift as traditional transistor scaling approaches its theoretical limits. Advanced packaging technologies—such as 2.5D and 3D integration, hybrid bonding, and copackaged optics are becoming critical enablers of performance for AI, and 5G applications. ...
Jan 8, 2026
VIEWPOINT 2026: Brent Fischthal, Head of Global Marketing Communications, Koh Young Technology, Inc.
Advanced packaging continues to reshape the semiconductor landscape, and the demands on metrology are rising just as quickly. As device architectures grow more intricate and materials push physical limits, process windows are tightening. The industry can no longer rely on periodic sampling or offline analysis. ...
Jan 7, 2026
VIEWPOINT 2026: Brian Schmaltz, Chief Operating Officer, NAMICS Corporation
2025, a year in review, shows the semiconductor market's projected 20% surge being revised to 12% as real-world conditions proved less robust than early forecasts. Slower inventory normalization, a gradual memory recovery, and renewed geopolitical and tariff pressures added costs across supply chains. ...
Jan 6, 2026
VIEWPOINT 2026: Brad Ferry, Director of Business Development, Circuit Technology Center
2025 continued a strong trajectory of record-breaking performance at Circuit Technology Center. We strengthened our position as a trusted provider of high-reliability rework and repair services, with growing demand across complex board-level rework, BGA reballing, component tinning, and component salvage. ...
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