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Viewpoint Index
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Feb 9, 2026
VIEWPOINT 2026: Minoru Inoue, Branch Manager of Semiconductor Materials Sales Branch, Sekisui Chemical
2025, aside from the slowdown in demand for power semiconductors due to the EV recession, the market conditions were generally the same as or better than the previous year. The temporary market stagnation caused by the advance demand in anticipation of tariff increases largely subsided in the first half ...
Feb 6, 2026
VIEWPOINT 2026: Marc Engel, CEO, Agileo Automation
The shift toward advanced packaging (AP) is fundamentally reshaping semiconductor manufacturing, blurring the lines between front-end and back-end processes. For equipment manufacturers, this evolution demands a dual transformation in automation strategy. As back-end fabs adopt AP techniques, they are ...
Feb 5, 2026
VIEWPOINT 2026: Ramachandran "Ram" K. Trichur , Global Market Segment Head, Henkel
The semiconductor packaging growth story continues to be written by the demanding, complex requirements of AI and high-performance computing (HPC) in the cloud and at the edge. The automotive sector, which is expected to rebound after recent challenges, is also driving innovation through advanced ...
Feb 4, 2026
VIEWPOINT 2026: Guido Ueberreiter, VP Semiconductor Strategy, VON ARDENNE
Talking about semiconductors in 2025 inevitably means discussing artificial intelligence (AI)—and the geopolitical challenges shaping the industry. However, we are seeing technological progress across many aspects of the industry. Single-digit nanometer logic technology is a fascinating segment ...
Feb 3, 2026
VIEWPOINT 2026: Doug Dixon, CEO, 360 BC Group Inc.
For 2026, we see semiconductor packaging entering its most transformative phase yet, driven by unprecedented demands from AI, high-density power electronics, heterogeneous integration, and the shift toward ultra-high-performance system architectures. As a technical marketing and content development ...
Feb 2, 2026
VIEWPOINT 2026: Greg DeLarge, President, Plasma Etch, Inc.
As we conclude another strong year, we are proud of the progress and innovation enjoyed by our organization and our customers. The performance and reliability of our plasma systems continue to be demonstrated across a wide range of applications from the circuit board industry to aerospace. We remain ...
Jan 30, 2026
VIEWPOINT 2026: Jochen Schuermans, Founder & CEO, Roartis
Known for specialisation in development of customized adhesive, micro-encapsulation, coating and sinter solutions for electronic assemblies, Roartis has again, in 2025, realized its best year ever. We feel that differentiation in technology, especially when offering customisation, fast, can really add significant value ...
Jan 29, 2026
VIEWPOINT 2026: Tobias Königer, Head of Product Management Semiconductor Packaging, DELO Industrial Adhesives
Silicon photonics, or photonic integrated circuits (PICs), are emerging as a key enabler for next generation data communication and computing. By routing and processing signals with photons on a silicon platform, PICs drastically increase bandwidth while minimizing latency and power dissipation. These are critical advantages ...
Jan 28, 2026
VIEWPOINT 2026: Bob Patti, Founder and CEO, NHanced Semiconductors
In 2026, advanced packaging will continue to grow. With that growth comes renewed focus on the perennial thermal problem – with more circuits stacked in smaller spaces, how can we prevent melt-down? Two solutions are emerging: diamond heat spreaders and in-package liquid cooling. Heat concentration at nanometer ...
Jan 27, 2026
VIEWPOINT 2026: Dr. Robert Wanninger, Senior Vice President Advanced Backend Solutions, SUSS
In 2025, Artificial Intelligence (AI) once more was the defining theme in the semiconductor ecosystem and emerged as a cornerstone of macroeconomic growth – with ~92% of U.S. GDP growth in H1 2025 driven by investment in AI data centers and the supporting technology, according to Harvard economist Jason Furman. ...
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