|
Viewpoint Index
|
|
|
Mar 12, 2026
VIEWPOINT 2026: Dr. Dev Gupta, CTO, APSTL llc
Advanced Packaging (AP) has now become recognized even by the Fabless Chip Designers of the now Silicon LESS Silicon Valley as the rapid & cost effective .way to rescue traditional Moore's Law from stagnation due to Physics (the rise of leakage current as FETs get smaller and the very complex & expensive ...
Mar 11, 2026
VIEWPOINT 2026: David Heller, CEO, Heller Industries
At Heller Industries, innovation drives our position as the leading thermal solution provider for SMT and semiconductor manufacturing. In 2026, we are excited to launch many new features including a revolutionary flux management system delivering unprecedented efficiency with low maintenance, batch reflow ...
Mar 10, 2026
VIEWPOINT 2026: Lukas Buske, CEO, Plasmatreat GmbH
Yes. We presented new technologies for atmospheric plasma jets for electronic and semiconductor applications at Productronica and Semicon Europa in November 2025. These new technologies will be presented at upcoming shows in 2026 and customers can run trials as we speak. Our PDW100 plasma nozzle ...
Mar 9, 2026
VIEWPOINT 2026: Rich DePoto, Business Development Manager, Uyemura
Uyemura has invested ambitiously in advanced chemical technologies. As such, we can find ourselves with extraordinary solutions . . . in search of problems. When adaptation advances slowly, this approach can appear inefficient – at least temporarily. Today's electrical design needs are clearly outpacing what's ...
Mar 6, 2026
VIEWPOINT 2026: Tom Solon, P.E., Director of Sales, RH Murphy Co.
2025 was a good year for RH Murphy Company and we look forward with guarded optimism to 2026. New automation equipment and staff are being added to support growth and customer needs. Demand for JEDEC matrix trays, waffle pack chip trays, test carriers and custom ESD trays grow steadily along with the connectivity ...
Mar 5, 2026
VIEWPOINT 2026: Dr. Nokibul Islam, Sr. Director, STATS ChipPAC
The semiconductor industry is undergoing rapid transformation, driven by strong growth in computing-intensive applications such as artificial intelligence (AI), high-performance computing (HPC), and advanced consumer electronics. Increasing demands from data processing, video streaming, gaming, and other data-heavy ...
Mar 4, 2026
VIEWPOINT 2026: Ross Berntson, President and CEO, Indium Corporation
Innovation is at the core of our culture, and we will continue expanding our product offerings in 2026. This includes advanced packaging materials and metal thermal interface materials designed to support high-performance computing, particularly AI-driven applications, where power density and thermal performance ...
Mar 3, 2026
VIEWPOINT 2026: Paul Crothers, Vice President of Semiconductor Segment, TransPak
The world's semiconductor supply chains will continue to shift toward higher-value, larger, and more complex equipment in 2026 to power AI and advanced nodes. To keep pace with the industry's needs, packaging and logistics solutions will need to become even more predictive and data-driven. At TransPak, ...
Mar 2, 2026
VIEWPOINT 2026: Sanjeev Aggarwal, CEO, Everspin Technologies
As we head into 2026, memory decisions are becoming less about lowest cost per bit and more about how systems actually behave in the real world. Power, reliability, and speed now drive many of those decisions, especially as edge AI, industrial automation, and aerospace applications continue to scale. We are seeing ...
Feb 27, 2026
VIEWPOINT 2026: Paolo Fioravanti, CEO, Circuits Integrated Hellas
As we approach 2026, the radio-frequency (RF) segment of the semiconductor industry is entering a period of sustained growth1, fueled by advanced 5G, non-terrestrial networks, satellite communications, and defense modernization. Market forecasts project the global RF semiconductor market to nearly double ...
|
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
|
