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Viewpoint Index
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Feb 27, 2026
VIEWPOINT 2026: Paolo Fioravanti, CEO, Circuits Integrated Hellas
As we approach 2026, the radio-frequency (RF) segment of the semiconductor industry is entering a period of sustained growth1, fueled by advanced 5G, non-terrestrial networks, satellite communications, and defense modernization. Market forecasts project the global RF semiconductor market to nearly double ...
Feb 26, 2026
VIEWPOINT 2026: Adrienne Downey, Senior Market Research Analyst, TechInsights
Artificial intelligence (AI) and high-performance computing (HPC) will continue to lead demand for advanced semiconductor nodes, memory and packaging through 2026. New technologies such as co-packaged optics (CPO) and silicon photonics (SiPho) are gaining momentum and are moving from research ...
Feb 25, 2026
VIEWPOINT 2026: Melissa Grupen-Shemansky, CTO and VP of Technology Coalitions, SEMI
Advanced packaging (AP) and heterogeneous integration (HI) now define the industry's trajectory as traditional scaling reaches its limits. The shift to multi-die architectures, chiplets, and 3D stacking is accelerating, driven by insatiable compute demand across AI, high-performance computing (HPC), data centers, and ...
Feb 24, 2026
VIEWPOINT 2026: John Kibarian, CEO, PDF Solutions
In 2026, the semiconductor industry will continue to see the growth of new AI cloud, edge and data center applications. Complex 3D packages and systems are the technology enablers of the growth of AI. It is creating manufacturing and R&D challenges that can only be addressed via an AI-based unified ...
Feb 23, 2026
VIEWPOINT 2026: Thomas Sonderman, CEO, SkyWater Technology
Advanced packaging is no longer a supporting act in semiconductor innovation. Performance gains are not coming from smaller nodes or faster clock speeds alone; they must now be unlocked through intelligent integration of advanced packaging processes into chip design from the start. In 2026, packaging firmly shifts ...
Feb 20, 2026
VIEWPOINT 2026: Abdul Lateef, CEO, Plasma-Therm LLC
As we enter 2026, Plasma-Therm remains committed to enabling advanced semiconductor manufacturing companies and research institutions to achieve breakthroughs in efficiency, precision, and innovation. Our systems and software continue to play a critical role in supporting our customer partners ...
Feb 19, 2026
VIEWPOINT 2026: Dr. Srikanth Kommu and Dan Brewer, co-CEOs, Brewer Science
Brewer Science proudly marks its 45th anniversary, reaffirming its mission: to be a company of the people, by the technology, for the customer. As the industry enters a new era of technological transformation, Brewer Science is committed to enabling breakthroughs that power AI, advanced ...
Feb 18, 2026
VIEWPOINT 2026: Irving Wang, Director of Marketing, MRSI Mycronic
2025 has been a great year for MRSI, Mycronic both in terms of revenue growth and new market development. We have benefited significantly from the booming demand for optical interconnect in AI clusters. Looking ahead, we see the growth driven by the AI cluster expansion continuing in 2026 and at least for a few ...
Feb 17, 2026
VIEWPOINT 2026: Casey Krawiec, VP of Global Sales, StratEdge Corporation
As a company specializing in the design, production, and assembly of high-frequency, high-power semiconductor packages for defense and aerospace applications, StratEdge experienced another strong year. Since 1985, we have been a leader in delivering high-performance packaging solutions for RF, microwave, ...
Feb 16, 2026
VIEWPOINT 2026: Konrad Roessler, CEO, Heidelberg Instruments Mikrotechnik GmbH
In 2025, Heidelberg Instruments, a supplier of direct-write lithography tools for R&D and industry, saw an increased demand from semiconductor packaging industry. The advantages of "maskless" are well-known: adaptability to distorted substrates, resolution below 2 microns, sharp patterns on warped substrates ...
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