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Hi-Rel Hermetic Package Sealing
Automated processing by the Robotic Cover Sealer. No skilled manual labor in cover seal. Robotic Materials Manager walk away automation provides rapid ROI.
MicroCircuit Laboratories, LLC

Technical Paper

Eliminating Interfacial Delamination in High-Power Automotive Devices

This study demonstrates that coating power devices with APTES adhesion promoter after wire bonding eliminates interfacial delamination, providing a simpler alternative to lead frame roughening technology.
Amkor Technology

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Ultra-Thin Wafer Handling
Brewer Science temporary wafer bonding systems allow for safe handling and transport of ultrathin wafers during rigorous backside processing steps.
Brewer Science