| Sponsor |
|
Epoxy for Dam-and-Fill Applications
Master Bond EP17HTDM-2 Black is a high temperature resistant, non-drip adhesive for bonding, sealing, encapsulating and dam-and-fill applications.
Master Bond
|
|
| Technical Paper |
Eliminating Interfacial Delamination in High-Power Automotive Devices
This study demonstrates that coating power devices with APTES adhesion promoter after wire bonding eliminates interfacial delamination, providing a simpler alternative to lead frame roughening technology.
Amkor Technology
Complete this form to download this Technical Paper.
|
|
|
|
More Technical Papers
Full Technical Paper List
|
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
Automatic Grading Without Assistance
Eliminate the need for operators to assess bond testing failure modes at the end of an automation run. Auto grading uses machine vision software to process the test result images.
xyztec
|
|
|