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Cu Pillar Flip Chip Cleaning
Evaluating appropriate chemistries to remove WS Flux residues and refining cleaning processes can meet challenges associated with producing Cu Pillar flip chips to improve reliability.
KYZEN

Technical Paper

Eliminating Interfacial Delamination in High-Power Automotive Devices

This study demonstrates that coating power devices with APTES adhesion promoter after wire bonding eliminates interfacial delamination, providing a simpler alternative to lead frame roughening technology.
Amkor Technology

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Indium Corporation