Eliminating Interfacial Delamination in High-Power Automotive Devices

This study demonstrates that coating power devices with APTES adhesion promoter after wire bonding eliminates interfacial delamination, providing a simpler alternative to lead frame roughening technology.
Amkor Technology

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Eliminate Lead Tinning Issues Before They Become Reliability Failures
Learn lead tinning methods, causes of tinning defects, and solutions from the experts at Circuit Technology Center to help ensure dependable solder connections.
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