High Temperature Resistant, Die Attach Epoxy
Master Bond EP17HTS-DA is an electrically conductive die attach epoxy that meets NASA low outgassing specifications and offers high temperature resistance. Master Bond
Technical Paper
Eliminating Interfacial Delamination in High-Power Automotive Devices
This study demonstrates that coating power devices with APTES adhesion promoter after wire bonding eliminates interfacial delamination, providing a simpler alternative to lead frame roughening technology.
Amkor Technology
Complete this form to download this Technical Paper.
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
Sponsor
Buy Ceramic Dispensing Needles Online
Ceramic needles with Luer Lok for conductive epoxies and encapsulation. The ceramic molding process allows for smaller more precise inner diameters with a glass like finish. Buy Online. DL Technology