| Technical Paper |
Eliminating Interfacial Delamination in High-Power Automotive Devices
This study demonstrates that coating power devices with APTES adhesion promoter after wire bonding eliminates interfacial delamination, providing a simpler alternative to lead frame roughening technology.
Amkor Technology
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Magazine loader to test lead frames
Hands-free automatic bond testing with a Sigma MAG magazine handler. Optional with SEMI S2 safety cabinet and/or loadport for top and front-loading (OHT and AGV).
xyztec
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