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Sponsor
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Ultra-Thin Wafer Handling
Brewer Science temporary wafer bonding systems allow for safe handling and transport of ultrathin wafers during rigorous backside processing steps.
Brewer Science
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| Industry Paper |
Eliminating Interfacial Delamination in High-Power Automotive Devices
This study demonstrates that coating power devices with APTES adhesion promoter after wire bonding eliminates interfacial delamination, providing a simpler alternative to lead frame roughening technology.
Amkor Technology, Inc.
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ECTC Call for Papers Due October 5
ECTC invites abstracts for its 77th conference. The leading packaging event will showcase 2.5D/3D integration, chiplets, hybrid bonding, panel-level packaging, photonics, glass substrates and advanced materials.
ECTC
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