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Sep 24, 2025 Nanosilica Filled, Dual Curable Adhesive Offers Rapid Fixturing with LED Light Master Bond LED422DC90 is a one component, nanosilica filled dual cure adhesive system engineered for high-speed fixturing and bonding of opaque substrates. This ... Master Bond Sep 24, 2025 Empower Semiconductor Secures Over $140M in Series D Financing Empower Semiconductor announced the closing of more than $140M in Series D financing. The investors, led by Fidelity Management & Research Company, include Maverick ... Empower Semiconductor Sep 24, 2025 Siemens accelerates complex semiconductor design and test with Tessent IJTAG Pro Siemens Digital Industries Software announced today Tessent™ IJTAG Pro software, which will transform IJTAG (IEEE 1687) input/output by enabling parallel operations ... Siemens Sep 24, 2025 Littelfuse Launches AEC-Q200-Compliant High-Voltage Fuses Rated Up to 1,000 VDC Littelfuse, Inc. announced the release of the 828 and 827 Series High Voltage Cartridge Fuses. These new fuses are the first AEC-Q200-compliant fuses rated at 1,000 VDC ... Littelfuse Sep 23, 2025 SEMI Issues Statement on U.S. H1-B Visa Policy Announcement SEMI released the following statement from SEMI Americas President Joe Stockunas on the United States H1-B policy proclamation issued by President Trump on September 19 ... SEMI Sep 23, 2025 ACM Research Unveils Ultra ECDP Electrochemical Deplating Tool ACM Research, Inc. announced the launch of its first Ultra ECDP Electrochemical Deplating (“Ultra ECDP”) tool specifically designed for wide bandgap compound semiconductor ... ACM Research, Inc. Sep 23, 2025 Freedom to choose leading multiplex immunofluorescence chemistries with ZEISS tissue multiplexing workflow ZEISS is introducing an enhanced workflow with the ZEISS Axioscan 7 spatial biology automated slide scanner, with an integrated newly launched data analysis solution ... ZEISS Sep 23, 2025 Value-optimized power-management IC for automotive applications The SPSA068 from STMicroelectronics is a compact, convenient, and cost-effective power-management IC (PMIC) for automotive applications. With configurable parameter ... STMicroelectronics Sep 22, 2025 ZEISS Medical Technology nominated for German Future Prize 2025 The Office of the Federal President announced the nominations for the German Future Prize 2025 at the Deutsches Museum in Munich. The nominees include Dr. Mark Bischoff ... Carl Zeiss Meditec AG Sep 22, 2025 Teledyne e2v and Viking Technology Announce Strategic Distribution Agreement Teledyne e2v Semiconductors and Viking Technology are pleased to announce a strategic distribution agreement. This collaboration brings together two industry leaders ... Teledyne e2v Semiconductors |
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