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Dec 24, 2025 Structural One Part Epoxy for High-Performance Bonding Applications Master Bond Supreme 10HTLV is a one part, non-frozen, heat cured epoxy formulated for demanding structural bonding applications. This toughened system features a moderately ... Master Bond Dec 24, 2025 CEA-Leti Worked with STMicroelectronics on Health & Wellness Breakthrough CEA-Leti has collaborated with STMicroelectronics to unveil a major step toward practical, continuous biochemical monitoring: a wearable patch prototype that analyzes ... CEA-Leti Dec 24, 2025 Power SiC faces overcapacity downturn while China accelerates domestic equipment ambitions The Power SiC market continues its transformation. Following an unprecedented investment wave between 2019 and 2024, the industry is now entering a correction cycle. Yole Group Dec 24, 2025 Heidelberg Instruments Reports Major Order for VPG+ 1850 FPD Volume Pattern Generator Heidelberg Instruments has received a substantial order from a top-tier photomask manufacturer in Asia for a VPG+ 1850 FPD system, developed on the established platform ... Heidelberg Instruments Mikrotechnik GmbH Dec 23, 2025 Kaman Measuring Highlights KD-2306 Non-Contact Displacement Sensing System The Measuring Division of Kaman Precision Products, Inc. highlights its KD-2306 single-channel, multi-purpose non-contact displacement sensing system. When paired with ... Kaman Dec 23, 2025 ZEISS concludes fiscal year 2024/25 with solid growth The ZEISS Group concluded fiscal year 2024/25 with solid growth. Revenue increased to 11.896 billion euros, and earnings before interest and taxes (EBIT) reached 1.552 ... ZEISS Dec 22, 2025 Automotive-Qualified Current Sensors for EV Battery, Motor, and Safety Systems Littelfuse, Inc. announced the release of six new automotive current sensors designed to enhance electric and hybrid vehicle performance, efficiency, and functional ... Littelfuse Dec 19, 2025 New ATS Heat Sinks Designed for NVIDIA Jetson Thor Modules Advanced Thermal Solutions, Inc. (ATS) has introduced a line of high-performance heat sinks engineered for NVIDIA Jetson Thor modules, providing robust thermal management ... Advanced Thermal Solutions, Inc. Dec 19, 2025 Saxony launches network for quantum technologies – starting signal for "Quantum Saxony" Quantum sciences and applications are rapidly advancing as key technologies for secure communication, high-performance computing, new materials, and ultra-precise sensing. ... Fraunhofer IPMS Dec 19, 2025 TOPPAN to Launch New FC-BGA Substrate Line at Niigata Plant TOPPAN Inc. has constructed a new manufacturing line at its Niigata Plant for Flip Chip-Ball Grid Array (FC-BGA) substrates, a form of high-density semiconductor packaging. ... TOPPAN |
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