| Press Release Index | |||
|
|||
|
|
|||
|
Jul 27, 2026 Amkor Technology Announces Strategic Partnership with NVIDIA to Expand Advanced Packaging Amkor Technology, Inc. announced a multi-year strategic partnership with NVIDIA to develop advanced semiconductor packaging and test technologies for next-generation ... Amkor Technology Jul 27, 2026 Siemens advances self-verifying agentic AI workflows for semiconductor and PCB design Siemens announced an expansion of its strategic partnership with NVIDIA to deliver self-verifying agentic AI workflows to EDA, helping semiconductor and printed circuit board ... Siemens Jul 27, 2026 FAMES Pilot Line & SiNANO Institute to Present FAMES' Latest Technical Results at ESSERC 2026 The FAMES Pilot Line and SiNANO Institute will host a joint half-day workshop, "FD-SOI Pilot Line Insights and Perspective," on Sept. 7 at ESSERC 2026, the European Solid-State ... FAMES Jul 27, 2026 SEMI Brings Semiconductor Industry Tax Leaders to Capitol Hill SEMI brought together executives from member companies for advocacy meetings on Capitol Hill focused on extending the tax credit for investments in building up the U.S. ... SEMI Jul 24, 2026 Advanced packaging: pricing power shifts as the market doubles The advanced packaging market has entered a new cycle. The historical backend model is being replaced by a system-scaling model in which packaging determines AI-compute ... YOLE Group Jul 23, 2026 Siemens to acquire Defacto Technologies to complement its EDA portfolio with automated SoC design creation Siemens announced that it has entered into an agreement to acquire Defacto Technologies, a privately held EDA software company active in the register-transfer level (RTL) ... Siemens Jul 23, 2026 EV Group Tops Customer Rankings in TechInsights Customer Satisfaction Survey EV Group announced that it has once again topped the rankings in the 2026 TechInsights Semiconductor Supplier Awards following results of TechInsights' 2026 Customer ... EV Group Jul 22, 2026 Koh Young America Promotes Ramiro Mora to Lead Service and Applications Koh Young Technology is pleased to announce the promotion of Ramiro Mora to Service and Applications Manager for Mexico and South America. The promotion recognizes ... Koh Young America Jul 22, 2026 Innolume Selects Veeco Gen2000™ MBE System to Expand Quantum Dot Laser Production Veeco Instruments Inc. announced that Innolume, a leading vertically integrated developer and manufacturer of quantum dot (QD) lasers, has purchased a GEN2000™ Molecular ... Veeco Instruments Inc. Jul 22, 2026 Siemens to acquire Precision Innovations to expand AI-powered system-on-a-chip design Siemens announced that it has signed an agreement to acquire Precision Innovations Inc., a privately held electronic design automation software company, expanding Siemens' ... Siemens |
|
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Insert Your Email Address |