Sponsor

IR Layer Release Technology for 3D Packaging and Logic Scaling
Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling.
EV Group

Technical Paper

Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems

This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now.
StratEdge Corporation

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Chiplets and Advanced Packaging
Chiplets represent a transformative approach to semiconductor design. This paper underscores the critical relationship between chiplets and material testing. Download now.
XYZTEC