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Technical Paper

Revolutionizing IC Packaging with High-Density RDL Technology

Amkor's S-SWIFT packaging technology addresses advanced IC packaging challenges through an embedded trace RDL process, providing higher bandwidth die-to-die interconnects for AI, HPC, and data center applications with improved reliability.
Amkor Technology

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Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more.
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