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Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more.
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Technical Paper

Revolutionizing IC Packaging with High-Density RDL Technology

Amkor's S-SWIFT packaging technology addresses advanced IC packaging challenges through an embedded trace RDL process, providing higher bandwidth die-to-die interconnects for AI, HPC, and data center applications with improved reliability.
Amkor Technology

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How to Cold Bump Pull?
Learn how to perform an optimal Cold Bump Pull test on solder balls using tweezers. This guide covers test method settings and failures modes for CBP all types of bump testing.
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