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Medical Grade, Toughened Epoxy
Master Bond Supreme 121AOMed is a thermally conductive, electrically insulating adhesive that resists repeated autoclaving and is used for bonding, sealing and encapsulation.
Master Bond
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Revolutionizing IC Packaging with High-Density RDL Technology
Amkor's S-SWIFT packaging technology addresses advanced IC packaging challenges through an embedded trace RDL process, providing higher bandwidth die-to-die interconnects for AI, HPC, and data center applications with improved reliability.
Amkor Technology
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High Capacity & Power Plasma Systems
The BT-1 high capacity plasma systems features 5 shelves & high power plasma up to 5000 watts! Reactive Ion Etching chamber configurations with liquid cooling are also available.
Plasma Etch
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