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FSO Hermetic Package HDHS® Technology
Seam sealing with metal to metal seals and low temperature exposure. Inside the hermetic package the atmosphere is precisely controlled. Auer package tooling reduces handling and contamination.
MicroCircuit Laboratories, LLC

Technical Paper

Revolutionizing IC Packaging with High-Density RDL Technology

Amkor's S-SWIFT packaging technology addresses advanced IC packaging challenges through an embedded trace RDL process, providing higher bandwidth die-to-die interconnects for AI, HPC, and data center applications with improved reliability.
Amkor Technology

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Elevate Efficiency: MRSI-H1 Die Bonder
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