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Remove Underfilled BGAs Without the Risk
Heat-based removal methods can lead to cratering, substrate delamination, and more. Cold precision milling offers a safer solution for BGA removal.
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Technical Paper

EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices

Debugging D2D I/O failures in heterogeneous packages is increasingly difficult due to limited access and test granularity. This paper shows how EOTPR accurately isolates chiplet interconnect defects with minimal prep, validated by a case study.
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