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Contamination Control
Balazs™ provides technical expertise in identifying and controlling Airborne Molecular Contamination (AMC) and Surface Molecular Contamination (SMC) for improving process and product yields.
Balazs Nanoanalysis

Technical Paper

Package Assembly Design Kits: The Future of Advanced Package Design

This white paper advocates for Package Assembly Design Kits (PADK) to streamline high-density fan-out package design by integrating manufacturing verification early, reducing design cycles and complexity.
Amkor Technology

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Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semiconductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH