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Turnkey Electroless Plating Solutions
PacTech delivers precision electroless plating with PACLINE^® and turnkey process transfers, trusted by IDMs worldwide for advanced semiconductor manufacturing success.
PacTech

Technical Paper

Package Assembly Design Kits: The Future of Advanced Package Design

This white paper advocates for Package Assembly Design Kits (PADK) to streamline high-density fan-out package design by integrating manufacturing verification early, reducing design cycles and complexity.
Amkor Technology

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Copper vs silver: a turning point for WBG die attach
Copper sintering is challenging silver's dominance in power semiconductors. Read how new materials are enabling high performance at lower cost.
Henkel AG & Co.