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See WLCSP Defects with Advanced 3D X-ray Microscopy
Two case studies show the effectiveness of high-res 3D XRM for detecting various defects in WLCSP containing RDL & Cu-pillar microbumps. Read more.
ZEISS Microscopy

Technical Paper

Package Assembly Design Kits: The Future of Advanced Package Design

This white paper advocates for Package Assembly Design Kits (PADK) to streamline high-density fan-out package design by integrating manufacturing verification early, reducing design cycles and complexity.
Amkor Technology

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Thermally Conductive, Low Outgassing Epoxy
Master Bond EP54TC is a thermally conductive, electrically insulating adhesive that combines good physical properties and the ability to transfer heat rapidly and effectively.
Master Bond