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Technical Papers Index
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Mar 19, 2019
Challenges in Automotive Package Development
Driven by space constraints and performance requirements, the automotive market is slowly transitioning to advanced packages such as wafer-level, flip ...
Amkor Technology, Inc.

Feb 28, 2019
3 Ways to Increase Plasma Uniformity
Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and ...
Plasma Etch Inc

Feb 20, 2019
UV-Adhesive Bonding for Stud-pull
The stud-pull method allows dies that are too thin/ large area to be shear tested, but this method has been ...
Nordson DAGE

Feb 19, 2019
Role of Sockets in IC Product Life Cycle
A single contact technology cannot satisfy all requirements for IC verification throughout its life cycle. A socket that has replaceable ...
Ironwood Electronics

Feb 6, 2019
MRS Sensor Technology for Challenging Measurement & Inspection
3D MRS sensor technology is being used for packaging inspection. The ultra-high-resolution MRS sensor has been demonstrated as highly effective ...
CyberOptics Corporation

Jan 15, 2019
Gold Planar Bumps for Flip Chip Bonding with Challenging Applications
Achieving consistent, quality Au Planar bumps has been a challenge that the industry has been trying to meet for years. ...
Palomar Technologies

Jan 7, 2019
Sequential Infiltration Synthesis: A New Lithographic Enhancement Method
U.S. national laboratory researchers have found that the many demands associated with the “resist” can be met by the use ...
Argonne National Laboratory

Dec 6, 2018
Achieving Low Voiding for Power Devices
For power device applications where low void concentration and reduced costs are important, learn how the solder paste solution, along ...
Palomar Technologies Inc.

Nov 26, 2018
Socket Cleaning on Handlers without Auto-Clean Functions
In-line preventative or on-demand, contactor cleaning execution extends socket lifetime, improves test cell uptime, and increases yield. For older ... ...
International Test Solutions

Nov 15, 2018
Active Optical Cable Transceiver Packaging Trends
EEL and VCSEL technologies from a packaging architectural view with case studies showing high accuracy pick and place of the ...
Palomar Technologies Inc.

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