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Technical Papers Index
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Apr 3, 2020
Low Latency Manufacturing for Biophotonic and Medical Packaging
The medical device market is expected to almost double in value to $90 billion by 2025. This article presents advanced ...
Palomar Technologies, Inc.

Mar 31, 2020
GHz Bandwidth Socket
For many products designed with today's high-performance integrated circuits, BGA socketing systems are an essential option during the design, testing, ...
Ironwood Electronics

Mar 24, 2020
Backside Metallization for Low Cost High Thermal Package
Advanced semiconductor packaging requirements for higher and faster performance continue to be the driver for mining and artificial intelligence (AI)/high ...

Mar 17, 2020
Barrier Properties of an Electroless Deposit of Co-W-P Alloy
Paper explores the copper diffusion barrier provided by a Co-W-P layer, and the diminishment of those properties when cobalt is ...
Uyemura International Corporation

Mar 10, 2020
New Insights with Integrated Metrology
SUSS MicroTec's new TM200/300 metrology modules reveal a clear picture of the coating process, automate tool qualification in HVM fabs ...
SUSS MicroTec SE

Mar 3, 2020
Thermal and Mechanical Analysis of Imaging BGA Image Sensor Package
The growing demand of smartphone, cameras and automotive pushes image sensor packaging to smaller form factor and more complex substrate ...
UTAC Group

Feb 25, 2020
Achieving High Accuracy Pattern Recognition for Die Bonding
Learn the challenges of vision processing and pattern recognition for die bonding and a state-of-the-art technology that uses radar referencing, ...
Palomar Technologies, Inc.

Feb 18, 2020
DOE relates spring probe variables to signal integrity
Insertion loss of the spring probe is one of the first parameters verified by the electrical test engineer, whether the ...
Ironwood Electronics

Feb 12, 2020
Imprint of High Quality DOEs
The SMILE technique enables the imprint of both nano- and microstructures and supports the fabrication of high quality DOEs, the ...
SUSS MicroTec SE

Feb 5, 2020
New Development of Thermally Enhanced GaN QFN with Heat Slug Attach Bonding Technology
GaN mosfet provides significantly lower resistance and low capacitance than silicon mosfet which makes GaN mosfet considered as alternative power ...
UTAC Group

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