October 23, 2025

Beijing Issues Questionnaires for U.S. Analog Chip Probe Beijing has launched an intensified anti-dumping probe into U.S. analog chips, issuing detailed questionnaires to foreign exporters, domestic makers, and importers. The investigation targets major U.S. chipmakers, collecting sales, cost, and customer data, raising stakes ahead of Trump-Xi talks. TrendForce

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Chip Packaging Giant ASE to Acquire ADI's Penang Plant, Expand Southeast Asia Footprint by 1H26 Southeast Asia is rising as a key semiconductor hub as Taiwan's ASE signs a binding MoU to acquire Analog Devices' Penang plant. Expected to close by 1H26, the deal expands advanced packaging capacity and deepens IDM–OSAT collaboration in Malaysia. TrendForce

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation. Technical Paper

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Texas Instruments signals that chip recovery is slowing Texas Instruments forecast slower growth as chip demand cools, projecting Q4 revenue of $4.22–$4.58 billion and $1.26 EPS. Trade frictions and weak industrial orders are damping its post-slump rebound, sending the Dallas-based chipmaker's stock lower. The Dallas Morning News

NextSilicon Details Runtime-Reconfigurable Architecture NextSilicon unveiled a runtime-reconfigurable dataflow chip that outperforms CPUs and GPUs on HPC workloads. Its software continuously identifies hot code paths and reconfigures ALUs in real time, accelerating computation while reducing energy waste and eliminating code rewrites. EE Times

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Technical Papers Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG A Universal AI-Powered Segmentation Model for PCBA & Semiconductor Peer viewpoint: semiconductor innovation for telecommunication networks Current Characterization of Various Cu RDL Designs In Wafer Level Packages (WLP) Peer viewpoint: AI data centers are driving a semiconductor revolution MORE TECHNICAL PAPERS

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Quanta says shipments of AI servers powered by Nvidia's GB300 increasing Quanta Computer's AI server shipments using Nvidia’s GB300 chips surged past GB200 models this quarter. Expanding output in the US and Thailand and a 50% revenue jump underscore strong growth fueled by strategic investments and supplier partnerships. Taipei Times

A "seating chart" for atoms helps locate their positions in materials MIT researchers have developed DIGIT, a computational method that lets optical microscopes pinpoint individual atoms in crystals by combining atomic structure maps with statistical analysis. This could advance quantum device design and reveal atomic-scale material defects safely. MIT News

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4 Weird Things You Can Turn into a Supercapacitor Scientists at Michigan Technological University turned plastic bottles into supercapacitors by converting PET into electrodes and separators. The fast-charging devices outperform traditional models slightly, offering a sustainable path for circular energy storage. IEEE Spectrum

Auto giant Volkswagen warns of output stoppages amid Nexperia chip disruption Volkswagen warned of possible short-term production disruptions as China restricts exports from Dutch chipmaker Nexperia. While output remains stable, the automaker is monitoring suppliers closely, underscoring industry fears of renewed chip shortages amid rising tensions. CNBC

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Multiple Challenges Emerge With Physical AI System Design Physical AI brings intelligence directly to the real world, enabling robots, vehicles, and devices to sense, interpret, and act autonomously. By combining edge computing, multi-modal sensing, and continuous learning, it transforms industries and human interaction with technology. Semiconductor Engineering

Nexperia crisis: how US-China tensions disrupt a global chip supply chain The Dutch government's seizure of China-owned chipmaker Nexperia has fractured its global supply chain, as Chinese plants resist European oversight, curb output, and restrict shipments—intensifying geopolitical tensions and hastening tech supply chain decoupling. South China Morning Post

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Silicon Valley Events Highlight Rapid Innovation from Power to Edge AI At OCP Summit, Synaptics Tech Day, and Infineon's OktoberTech, Silicon Valley leaders showcased AI's rapid advance—from data centers to edge, robots, and quantum tech—stressing collaboration, modular design, and ecosystem partnerships to drive innovation. EE Times

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