November 12, 2025

How Advanced Packaging is Unleashing Possibilities for Edge AI The rapid shift of AI from the cloud to edge devices is driving a 17% CAGR, with over 2 billion devices expected by 2030. To meet strict power and cost limits, chipmakers are adopting selective 3D vertical stacking to boost performance and efficiency. EE Times

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HBM Leads The Way To Defect-Free Bumps High-bandwidth memory (HBM) is powering AI breakthroughs but straining manufacturing limits. As TSV, microbump, and wafer-thinning issues mount, SK hynix, Samsung, and Micron are turning to hybrid bonding and advanced inspection to maintain yields at sub-10-micron scales. Semiconductor Engineering

Analysis Of Multi-Chiplet Package Designs and Requirements for Production Test Simplification This white paper discusses the rising complexity of multi-die semiconductor packages, challenges in testing interconnected chips, and how standards like UCIe simplify production testing workflows. Technical Paper

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TSMC, Samsung Reportedly Cut 8-Inch Wafer Output, Boosting Korea’s DB HiTek Samsung and TSMC are retreating from 200mm foundry production to prioritize 300mm wafers for advanced chips like GPUs. Their shift is fueling growth for Korea's DB HiTek, whose 200mm expertise and surging power semiconductor demand are driving profits and utilization. TrendForce

AMD's Lisa Su sees 35% annual sales growth driven by 'insatiable' AI demand AMD CEO Lisa Su projected 35% annual revenue growth over the next three to five years, fueled by soaring AI chip demand. She expects AMD's AI data center business to grow 80% annually, reaching tens of billions in sales by 2027. CNBC

Sponsor Tech Paper - Keys to Component Lead Tinning Success This paper examines the challenges and best practices of component tinning, with a focus on temperature control, flux selection, and soldering techniques. Circuit Technology Center

Technical Papers Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG A Universal AI-Powered Segmentation Model for PCBA & Semiconductor Peer viewpoint: semiconductor innovation for telecommunication networks Current Characterization of Various Cu RDL Designs In Wafer Level Packages (WLP) Peer viewpoint: AI data centers are driving a semiconductor revolution MORE TECHNICAL PAPERS

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AI agents open door to new hacking threats Cybersecurity experts are warning that AI agents—the next wave of generative AI—could be hijacked by hackers through "query injection" attacks. These exploits can manipulate AI actions in real time, prompting major firms to bolster defenses and call for stricter user oversight. Taipei Times

ChipMOS bullish on AI memory drive ChipMOS Technologies forecasts a strong 2026 for the global memory market, powered by soaring AI data center demand. With memory packaging revenue up 24.9% year-on-year, the firm plans moderate capacity expansion and potential price hikes amid rising costs. Taipei Times

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Arm's DreamBig Acquisition Reignites In-house Chip Prospects Arm has acquired DreamBig Semiconductor for $265 million to accelerate its AI and data center strategy. DreamBig's MARS chiplet platform and Mercury AI-SuperNIC bring high-bandwidth, energy-efficient connectivity, bolstering Arm's push to design and market its own AI chips. EE Times

AI spending is not all equal. Wall Street rewards hyperscalers, punishes DoorDash and Duolingo As AI-driven investments surge, tech giants like Amazon, Google, and Microsoft are being rewarded for higher spending, while smaller firms such as DoorDash, Duolingo, and Roblox face sharp stock declines as investors question their costly growth strategies and profitability outlook. CNBC

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AI Memory: Enabling The Next Era Of High-Performance Computing AI's explosive growth is fueling demand for high-bandwidth, energy-efficient memory. HBM dominates training with stacked designs that boost speed and efficiency, while LPDDR powers inference and edge AI. Advanced packaging is transforming memory design and testing. Semiconductor Engineering

New Rules Put The Squeeze On Semiconductor Gray Market The rise of chiplets and multi-die assemblies is pushing global collaboration to secure semiconductor supply chains. Governments & chipmakers are rapidly adopting digital certificates to prevent counterfeiting, improve traceability & meet new HPC and regulatory demands. Semiconductor Engineering

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Thermal Sensing Headache Finally Over For 2nm And Beyond proteanTecs has launched a silicon-proven thermal sensing solution accurate to ±1.0°C for 5nm, 3nm, and 2nm SoCs. Replacing diode-based sensors that falter below 3nm, it delivers precise, low-voltage temperature monitoring vital for power efficiency and chip reliability. Semiconductor Engineering

Sponsor How heterogenous packaging benefits from atmospheric argon plasma Semiconductor packaging plasma processing improves reliability and yield. Chip manufacturers can rely on plasma processes to enhance applications. Surfx Technologies