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packaging news
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CyberOptics

New Quadra Pro Manual X-Ray System
Sets a new standard for high-resolution 3D/2D manual inspection with exceptional image clarity and reduced noise levels Learn more.
Nordson TEST & INSPECTION
Industry Press
Indium Corporation Expert to Present on Advancing Thermal Performance at TestConX China
Indium Corporation
SEMICON Japan 2025 to Spotlight Sustainability in AI and Semiconductor Innovation
SEMI
Glass core substrates and glass interposers: new growth engines for glass
YOLE Group
PAC Strapping Products Highlights its Cost-Effective Polypropylene Strapping
PAC Strapping
Indium Introduces 2026 DIY Internship Program to Empower the Next Gen of Industry Leaders
Indium Corporation
AI drives the wheel: how computing power is reshaping the automotive industry
YOLE Group
Singapore's largest industrial district cooling system begins operations
STMicroelectronics
GigaDevice Deepens Commitment to Japan, Advancing Local Services and Global Collaboration
GigaDevice
MORE INDUSTRY PRESS
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Nordson-ASYMTEK

Explore Reliable Solutions for WLP & PLP
For wafer- and panel-level packaging, you can rely on Nordson Electronics Solutions: fluid dispensing, plasma cleaning & more. Discover your solutions.
Nordson Electronics Solutions
Plasma-Etch
What Year Was It?
Hostage Crisis in Moscow Theater
What Year
About 50 Chechen rebels storm a Moscow theater, taking up to 700 people hostage during a sold-out performance of a popular musical.
See the answer below.
Ontos-Equipment-Systems
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EV-Group

Fusion and Hybrid Bonding Experts
EVG's industry-leading process solutions, expertise and HI Competence Center accelerate the development and implementation of heterogeneous integration technology.
EV Group
Amkor-Technology
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Coresix-Precision-Glass

High-Quality, High-Volume Glass Wafers
Many do one or the other — we do both. Quality, cleanliness, parallelism, flatness, roughness, serialization, traceability, consistency. Every wafer in spec, every time.
Coresix Precision Glass
What Year Was It Answer
Hostage Crisis in Moscow Theater
Answer: October 23, 2002
October 23, 2025
image
Beijing Issues Questionnaires for U.S. Analog Chip Probe
Beijing has launched an intensified anti-dumping probe into U.S. analog chips, issuing detailed questionnaires to foreign exporters, domestic makers, and importers. The investigation targets major U.S. chipmakers, collecting sales, cost, and customer data, raising stakes ahead of Trump-Xi talks.
TrendForce
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Henkel-AG-Co

The experts agree
Performance and reliability top the priority list for semiconductor experts. Get our latest Research Report to explore how they’re addressing AI demands, integration challenges, and next-gen materials.
Henkel AG & Co.
Chip Packaging Giant ASE to Acquire ADI's Penang Plant, Expand Southeast Asia Footprint by 1H26
Southeast Asia is rising as a key semiconductor hub as Taiwan's ASE signs a binding MoU to acquire Analog Devices' Penang plant. Expected to close by 1H26, the deal expands advanced packaging capacity and deepens IDM–OSAT collaboration in Malaysia.
TrendForce
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Technical Paper
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Circuit-Technology-Center

Are Your BGA Rework Operators Competent?
Can every operator handle your BGA rework equally well? In real life, in all but just a few situations, the answer is no. Why is this so?
Circuit Technology Center
Texas Instruments signals that chip recovery is slowing
Texas Instruments forecast slower growth as chip demand cools, projecting Q4 revenue of $4.22–$4.58 billion and $1.26 EPS. Trade frictions and weak industrial orders are damping its post-slump rebound, sending the Dallas-based chipmaker's stock lower.
The Dallas Morning News
NextSilicon Details Runtime-Reconfigurable Architecture
NextSilicon unveiled a runtime-reconfigurable dataflow chip that outperforms CPUs and GPUs on HPC workloads. Its software continuously identifies hot code paths and reconfigures ALUs in real time, accelerating computation while reducing energy waste and eliminating code rewrites.
EE Times
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Ormet-TLPS

Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Technical Papers
Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications
Eliminating Interfacial Delamination in High-Power Automotive Devices
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
A Universal AI-Powered Segmentation Model for PCBA & Semiconductor
Peer viewpoint: semiconductor innovation for telecommunication networks
Current Characterization of Various Cu RDL Designs In Wafer Level Packages (WLP)
Peer viewpoint: AI data centers are driving a semiconductor revolution
MORE TECHNICAL PAPERS
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Indium-Corporation

Proven SiPaste® for Ultrafine-Pitch Printing
Boost SPI yields with SiPaste® C312HF. Formulated for fine feature printing, it combines best-in-class stencil print transfer efficiency and excellent stencil life.
Indium Corporation
Quanta says shipments of AI servers powered by Nvidia's GB300 increasing
Quanta Computer's AI server shipments using Nvidia’s GB300 chips surged past GB200 models this quarter. Expanding output in the US and Thailand and a 50% revenue jump underscore strong growth fueled by strategic investments and supplier partnerships.
Taipei Times
A "seating chart" for atoms helps locate their positions in materials
MIT researchers have developed DIGIT, a computational method that lets optical microscopes pinpoint individual atoms in crystals by combining atomic structure maps with statistical analysis. This could advance quantum device design and reveal atomic-scale material defects safely.
MIT News
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Advanced-Component-Labs

High Density I/C Substrates – 50um "Stay Flat" CORES - USA FAB
Interposers/High Layer Counts – Low Loss/Low CTE Materials – 20µm Dielectrics /12µm Traces - ITAR Registered. Learn more.
Advanced Component Labs, Inc.
4 Weird Things You Can Turn into a Supercapacitor
Scientists at Michigan Technological University turned plastic bottles into supercapacitors by converting PET into electrodes and separators. The fast-charging devices outperform traditional models slightly, offering a sustainable path for circular energy storage.
IEEE Spectrum
Auto giant Volkswagen warns of output stoppages amid Nexperia chip disruption
Volkswagen warned of possible short-term production disruptions as China restricts exports from Dutch chipmaker Nexperia. While output remains stable, the automaker is monitoring suppliers closely, underscoring industry fears of renewed chip shortages amid rising tensions.
CNBC
Sponsor
AI-Technology-Inc

Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology, Inc.
Multiple Challenges Emerge With Physical AI System Design
Physical AI brings intelligence directly to the real world, enabling robots, vehicles, and devices to sense, interpret, and act autonomously. By combining edge computing, multi-modal sensing, and continuous learning, it transforms industries and human interaction with technology.
Semiconductor Engineering
Nexperia crisis: how US-China tensions disrupt a global chip supply chain
The Dutch government's seizure of China-owned chipmaker Nexperia has fractured its global supply chain, as Chinese plants resist European oversight, curb output, and restrict shipments—intensifying geopolitical tensions and hastening tech supply chain decoupling.
South China Morning Post
Sponsor
Master-Bond

Silver Filled, Heat Curing Epoxy
Master Bond EP4S-80 is a one part, electrically conductive, silver filled adhesive for bonding, sealing and coating with a low curing temperature of 80°C.
Master Bond
Silicon Valley Events Highlight Rapid Innovation from Power to Edge AI
At OCP Summit, Synaptics Tech Day, and Infineon's OktoberTech, Silicon Valley leaders showcased AI's rapid advance—from data centers to edge, robots, and quantum tech—stressing collaboration, modular design, and ecosystem partnerships to drive innovation.
EE Times
Sponsor
Tresky

UV DIE Bonding Special Technology
Liquid adhesive is cured using ultraviolet (UV) light. In contrast to epoxy, the UV adhesive remains in the liquid state until it is exposed to high-energy UV radiation with UV DIE Bonding technology.
Tresky Automation
Today's Sponsor
XYZTEC
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XYZTEC

How to Tweezer Pull
Learn how to perform an optimal Pull/Peel test using Tweezers. This guide covers test method settings and failures modes for Tweezer Pull/Peel testing. Download it now.
xyztec
Test Your Knowledge
What does a pluviometer measure?
See answer below.
ZEISS
Quote of the Day
"We aim above the mark to hit the mark."
Ralph Waldo Emerson
Sponsor
Surfx-Technologies

Plasma Processing Wafers and Dies
The STW-10 automated plasma system optimizes front-end semiconductor processing, activating silicon surfaces for hybrid bonding. It handles 300 mm wafers or dies on tape frames.
Surfx Technologies
Industry Calendar
Nov 2, 2025
International Trade Partners Conference (ITPC)
SEMI
Nov 3, 2025
Wafer Fab Processing | Phoenix, AZ
Semitracks
Nov 18, 2025
SEMICON Europa 2025
SEMI
Nov 19, 2025
MEMS & Imaging Sensors Summit
SEMI
Dec 17, 2025
SEMICON Japan 2025
SEMI
FULL INDUSTRY CALENDAR
kyzen
Cartoon of the Day
Cartoon
"There is always room for improvement. It's a small room with no windows or distractions. We already moved your things."
Copyright © Randy Glasbergen
Sponsor
Pac-Tech

A study about 3D stacking of passive SMD elements
This study demonstrates laser assisted bonding (LAB) of SMD Tantal Elko and MLCC capacitors and presents a comparison to conventional bonding using solder paste and reflow oven.
PacTech
Brewer-Science
Test Your Knowledge Answer
What does a pluviometer measure?
Answer: Rainfall.