semiconductor
packaging news
Sponsor
Nordson-ASYMTEK

Explore Reliable Solutions for WLP & PLP
For wafer- and panel-level packaging, you can rely on Nordson Electronics Solutions: fluid dispensing, plasma cleaning & more. Discover your solutions.
Nordson Electronics Solutions
Industry Press
Nordson Test & Inspection Unveils Latest Inspection and Metrology Solutions at SEMICON West 2025
Nordson Test & Inspection
EV Group Highlights Hybrid Bonding, Lithography and More at SEMICON West
EV Group
Indium Corporation Features Next-Generation Materials for Semiconductor Assembly at IMAPS
Indium Corporation
scia Systems Showcases New Innovations at SEMICON West 2025
scia Systems GmbH
Indium Corporation Expert to Present on Innovative Thermal Management Solution at IMAPS Thermal Conference
Indium Corporation
Koh Young to Showcase Semiconductor Metrology and Advanced Packaging Inspection Solutions at iMAPS
Koh Young Technology
Visit the YINCAE Advanced Materials booth at iMAPS 2025, booth 817
YINCAE Advanced Materials
MIRTEC to Showcase Cutting-Edge 3D Semiconductor Inspection Systems at the 2025 SEMICON West
MIRTEC
MORE INDUSTRY PRESS
Sponsor
DL-Technology

EZ-FLO High Precision Dispense Tips
Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more.
DL Technology
Pac-Tech
What Year Was It?
Hollywood Icon Rock Hudson Dies of AIDS
What Year
Actor Rock Hudson, 59, becomes the first major U.S. celebrity to die of complications from AIDS.
See the answer below.
Plasma-Etch
Sponsor
Ontos-Equipment-Systems

OntosIS Atmospheric Plasma System
The ONTOS Plasma Head is available for integration into third party equipment. The Plasma Curtain is available in several widths to enable optimization of the gas consumption on smaller devices.
Ontos Equipment Systems
Akrometrix
Sponsor
Coresix-Precision-Glass

High-Quality, High-Volume Glass Wafers
Many do one or the other — we do both. Quality, cleanliness, parallelism, flatness, roughness, serialization, traceability, consistency. Every wafer in spec, every time.
Coresix Precision Glass
What Year Was It Answer
Hollywood Icon Rock Hudson Dies of AIDS
Answer: October 2, 1985
October 3, 2025
Huawei to boost AI chip output despite additional US curbs
Huawei is ramping up its AI chip ambitions, aiming to double Ascend 910C output to 600,000 units in 2026 and produce 1.6 million dies overall. The company plans four new Ascend chips, leveraging self-developed HBM technology amid U.S. sanctions.
Asia Times
Sponsor
Tresky

Contract service: DIE Bonding prototyping & small series production
Our services reduce time-to-market. We can quickly produce small batches on demand without you having to build up production capacities. Learn more.
Tresky Automation
From chip power to state leverage
Taiwan briefly imposed export controls on 47 products, including semiconductors, to pressure South Africa over its office relocations, then lifted them after Pretoria sought talks, demonstrating Taipei's ability to leverage its semiconductor dominance as a strategic diplomatic tool.
Taipei Times
In situ hydrogen plasmas — A New Paradigm for Advanced Packaging
In situ hydrogen plasmas are critical for developing 3D chips with dense interconnects and high signal speeds. Atmospheric pressure hydrogen plasma offers a reliable, flux-free method for oxide removal before thermocompression bonding.
Technical Paper
Sponsor
Indium-Corporation

No-Clean, Flip-Chip and Ball-Attach Flux
Improve yields with NC-809, the industry leading, true no-clean, ultra-low residue, flip-chip and ball-attach flux suitable for many semiconductor applications.
Indium Corporation
Chip export controls show fangs
Taiwan imposed export controls on 47 semiconductor products to South Africa after Pretoria downgraded its office, pressing it to resume talks. The move shows Taiwan's tougher sovereignty stance and shift toward technology-driven diplomacy.
Taipei Times
Global chipmakers gain US$200bn in record rally
Global chipmakers surged as AI enthusiasm fueled a tech rally, lifting valuations by over US$200 billion. Deals involving OpenAI, Intel, and South Korean firms drove gains, while investors' FOMO overshadowed bubble concerns, pushing stocks to record highs worldwide.
3DInCites
Sponsor
XYZTEC

Full automation bond testers
A Sigma eliminates human error and comes with game-changing automation capabilities, robotic handlers, and smart vision cameras for operator-free bond testing and analysis. Learn more.
xyztec
Technical Papers
Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications
Eliminating Interfacial Delamination in High-Power Automotive Devices
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
A Universal AI-Powered Segmentation Model for PCBA & Semiconductor
Peer viewpoint: semiconductor innovation for telecommunication networks
Current Characterization of Various Cu RDL Designs In Wafer Level Packages (WLP)
Peer viewpoint: AI data centers are driving a semiconductor revolution
MORE TECHNICAL PAPERS
Sponsor
CyberOptics

SQ7000+TM Multi-Function for 3D AOI, SPI & CMM
The SQ7000+ with MRS® sensor technology delivers high-resolution, high-speed inspection and metrology, uniquely combining AOI, SPI, and CMM in one in-line system.
Nordson Test & Inspection
OpenAI officials tour Samsung Electronics' chip plant
OpenAI executives toured Samsung's Pyeongtaek fab after signing a collaboration LOI to source low-power memory for its Stargate project. Samsung pledged support for soaring AI demand, with capacity to supply up to 900,000 DRAM wafers per month.
Yonhap News Agency
Smarter Packaging: How AI is Reshaping Assembly and Materials Control
Advanced packaging is turning to AI to reduce defects, predict equipment failures, and trace faults across multi-die assemblies. By blending sparse process data with equipment telemetry, AI enables predictive maintenance, excursion control, and faster, more accurate yield optimization.
Semiconductor Engineering
Sponsor
Ironwood-Electronics

Near Zero Footprint Sockets
Surface mount solder like device; 0.35mm to 1.27mm pitch; socket footprint-1mm larger; -55C to + 160C; 3 different lid options; 1dB at 43 GHz.
Ironwood Electronics
Why current AI models won't make scientific breakthroughs, according to a top tech exec
Hugging Face co-founder Thomas Wolf said current AI models like ChatGPT are unlikely to deliver major scientific breakthroughs, arguing they predict likely words rather than novel ideas. He envisions AI serving as a research "co-pilot" for human scientists instead.
CNBC
Taiwan rejects U.S. proposal for ’50-50′ chip production, says trade talks focused on tariffs
Taiwan rejected Washington's proposal to split semiconductor production 50-50, insisting talks focused on tariffs and export levies. Officials defended Taiwan's chip dominance, warning the plan could undermine TSMC, the island's "Silicon Shield," critical to its global and defense standing.
CNBC
Sponsor
Circuit-Technology-Center

Tech Paper - The Economics of Electronic Component Salvage and Reuse
This paper examines the economic and environmental benefits of salvaging and reusing high-value electronic components.
Circuit Technology Center
Accounting for uncertainty to help engineers design complex systems
MIT researchers have developed a new framework that helps engineers design complex systems—like drones or autonomous vehicles—by modeling interconnected components under uncertainty, capturing tradeoffs and likely outcomes to create more robust, reliable designs.
MIT News
Samsung, SK Hynix shares leap after OpenAI chip deal
Shares of Samsung Electronics and SK Hynix surged after partnering with OpenAI to support its Stargate AI data center project. Samsung hit a four-year high, SK Hynix reached an all-time peak, boosting their combined market value by $37 billion.
Reuters
Sponsor
Ormet-TLPS

Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
OpenAI Meets Foxconn, TSMC, Heads to Korea to Explore Samsung, SK hynix
OpenAI CEO Sam Altman visited Taiwan to discuss the U.S. "Stargate" AI project with Foxconn and TSMC, covering AI server supply and in-house chip production. Plans include five U.S. data centers and expanded semiconductor ties with South Korea.
TrendForce
Sponsor
AI-Technology-Inc

TIM1 for EV Battery Thermal Management
AIT's thermal adhesives, grease-gels, & gum-pads offer proven thermal dissipation for a balance of strength, rework ability, & recyclability of EV battery packs.
AI Technology
Today's Sponsor
EV-Group
Sponsor
EV-Group

IR Layer Release Technology for 3D Packaging and Logic Scaling
Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling.
EV Group
Test Your Knowledge
What is used to measure horizontal and vertical angles in surveying?
See answer below.
Balazs-Nanoanalysis
Quote of the Day
"My idea of an agreeable person is a person who agrees with me."
Benjamin Disraeli
Sponsor
Master-Bond

One Component, Fast Curing Epoxy
Master Bond EP4EN-80 is a NASA low outgassing approved adhesive for potting and encapsulation. It cures at 80°C and features thermal conductivity and electrical insulation.
Master Bond
Industry Calendar
Oct 6, 2025
Fundamentals of EUV/Phoenix,AZ/during SEMICON West
PT International LLC
Oct 6, 2025
Basic Electronics and Troubleshooting/Phoenix,AZ/During SEMICON West
PT International LLC
Oct 6, 2025
Wet Processing for the Semiconductor Industry/Phoenix,AZ/during SEMICON West
PT International LLC
Oct 6, 2025
Fundamentals of Atomic Layer Deposition(ALD)/Phoenix,AZ/during SEMICON West
PT International LLC
Oct 6, 2025
Plasma Etching, ALE, & RIE
PT International LLC
FULL INDUSTRY CALENDAR
Brewer-Science
Cartoon of the Day
Cartoon
"I don't know if it's burnout, but I set off the smoke alarm six times today!"
Copyright © Randy Glasbergen
Sponsor
Surfx-Technologies

In situ hydrogen plasmas — A New Paradigm for Advanced Packaging
Hydrogen plasmas drive breakthroughs in 3D chip technology, enabling ultra-dense interconnects and faster signal speeds above 5 GHz.
Surfx Technologies
Plasmatreat-GmbH
Test Your Knowledge Answer
What is used to measure horizontal and vertical angles in surveying?
Answer: A theodolite