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Explore Reliable Solutions for WLP & PLP
For wafer- and panel-level packaging, you can rely on Nordson Electronics Solutions: fluid dispensing, plasma cleaning & more. Discover your solutions.
Nordson Electronics Solutions
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EZ-FLO High Precision Dispense Tips
Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more.
DL Technology
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What Year Was It?
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Hollywood Icon Rock Hudson Dies of AIDS
Actor Rock Hudson, 59, becomes the first major U.S. celebrity to die of complications from AIDS.
See the answer below.
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OntosIS Atmospheric Plasma System
The ONTOS Plasma Head is available for integration into third party equipment. The Plasma Curtain is available in several widths to enable optimization of the gas consumption on smaller devices.
Ontos Equipment Systems
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High-Quality, High-Volume Glass Wafers
Many do one or the other we do both. Quality, cleanliness, parallelism, flatness, roughness, serialization, traceability, consistency. Every wafer in spec, every time.
Coresix Precision Glass
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What Year Was It Answer
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Hollywood Icon Rock Hudson Dies of AIDS Answer: October 2, 1985
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October 3, 2025
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Huawei to boost AI chip output despite additional US curbs
Huawei is ramping up its AI chip ambitions, aiming to double Ascend 910C output to 600,000 units in 2026 and produce 1.6 million dies overall. The company plans four new Ascend chips, leveraging self-developed HBM technology amid U.S. sanctions.
Asia Times
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From chip power to state leverage
Taiwan briefly imposed export controls on 47 products, including semiconductors, to pressure South Africa over its office relocations, then lifted them after Pretoria sought talks, demonstrating Taipei's ability to leverage its semiconductor dominance as a strategic diplomatic tool.
Taipei Times
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No-Clean, Flip-Chip and Ball-Attach Flux
Improve yields with NC-809, the industry leading, true no-clean, ultra-low residue, flip-chip and ball-attach flux suitable for many semiconductor applications.
Indium Corporation
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Chip export controls show fangs
Taiwan imposed export controls on 47 semiconductor products to South Africa after Pretoria downgraded its office, pressing it to resume talks. The move shows Taiwan's tougher sovereignty stance and shift toward technology-driven diplomacy.
Taipei Times
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Global chipmakers gain US$200bn in record rally
Global chipmakers surged as AI enthusiasm fueled a tech rally, lifting valuations by over US$200 billion. Deals involving OpenAI, Intel, and South Korean firms drove gains, while investors' FOMO overshadowed bubble concerns, pushing stocks to record highs worldwide.
3DInCites
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Full automation bond testers
A Sigma eliminates human error and comes with game-changing automation capabilities, robotic handlers, and smart vision cameras for operator-free bond testing and analysis. Learn more.
xyztec
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SQ7000+TM Multi-Function for 3D AOI, SPI & CMM
The SQ7000+ with MRS® sensor technology delivers high-resolution, high-speed inspection and metrology, uniquely combining AOI, SPI, and CMM in one in-line system.
Nordson Test & Inspection
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OpenAI officials tour Samsung Electronics' chip plant
OpenAI executives toured Samsung's Pyeongtaek fab after signing a collaboration LOI to source low-power memory for its Stargate project. Samsung pledged support for soaring AI demand, with capacity to supply up to 900,000 DRAM wafers per month.
Yonhap News Agency
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Smarter Packaging: How AI is Reshaping Assembly and Materials Control
Advanced packaging is turning to AI to reduce defects, predict equipment failures, and trace faults across multi-die assemblies. By blending sparse process data with equipment telemetry, AI enables predictive maintenance, excursion control, and faster, more accurate yield optimization.
Semiconductor Engineering
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Near Zero Footprint Sockets
Surface mount solder like device; 0.35mm to 1.27mm pitch; socket footprint-1mm larger; -55C to + 160C; 3 different lid options; 1dB at 43 GHz.
Ironwood Electronics
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Accounting for uncertainty to help engineers design complex systems
MIT researchers have developed a new framework that helps engineers design complex systems—like drones or autonomous vehicles—by modeling interconnected components under uncertainty, capturing tradeoffs and likely outcomes to create more robust, reliable designs.
MIT News
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Samsung, SK Hynix shares leap after OpenAI chip deal
Shares of Samsung Electronics and SK Hynix surged after partnering with OpenAI to support its Stargate AI data center project. Samsung hit a four-year high, SK Hynix reached an all-time peak, boosting their combined market value by $37 billion.
Reuters
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TIM1 for EV Battery Thermal Management
AIT's thermal adhesives, grease-gels, & gum-pads offer proven thermal dissipation for a balance of strength, rework ability, & recyclability of EV battery packs.
AI Technology
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Today's Sponsor |
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Test Your Knowledge
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What is used to measure horizontal and vertical angles in surveying?
See answer below.
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Quote of the Day
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"My idea of an agreeable person is a person who agrees with me." Benjamin Disraeli
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One Component, Fast Curing Epoxy
Master Bond EP4EN-80 is a NASA low outgassing approved adhesive for potting and encapsulation. It cures at 80°C and features thermal conductivity and electrical insulation.
Master Bond
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Industry Calendar |
Oct 6, 2025
Fundamentals of EUV/Phoenix,AZ/during SEMICON West
PT International LLC
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Oct 6, 2025
Basic Electronics and Troubleshooting/Phoenix,AZ/During SEMICON West
PT International LLC
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Oct 6, 2025
Wet Processing for the Semiconductor Industry/Phoenix,AZ/during SEMICON West
PT International LLC
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Oct 6, 2025
Fundamentals of Atomic Layer Deposition(ALD)/Phoenix,AZ/during SEMICON West
PT International LLC
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Oct 6, 2025
Plasma Etching, ALE, & RIE
PT International LLC
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FULL INDUSTRY CALENDAR
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Cartoon of the Day
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"I don't know if it's burnout, but I set off the smoke alarm six times today!"
Copyright © Randy Glasbergen
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Test Your Knowledge Answer
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What is used to measure horizontal and vertical angles in surveying? Answer: A theodolite
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