June 23, 2026

TSMC Reportedly Cuts 28nm Output by Over 25% as Advanced Node Push Accelerates TSMC is cutting 28nm output as it converts Fab 15A into a 4nm production site, reducing monthly 28nm wafer starts by about 25%. The shift supports investment in 2nm, A14, SoIC, and photonics, while creating spillover demand opportunities for UMC and Vanguard. TrendForce

Sponsor Automotive chips need materials that DO NOT fail We asked semiconductor specialists what defines the future of automotive packaging. Reliability, thermal management, and sustainability topped the list. Free Research Report. Henkel AG & Co.

SanDisk Goes Beyond HBF: Patent Bonds Processor onto NAND Tile, with HBM Stacks on Shared Interposer SanDisk's latest patent combines NAND flash, HBM, and integrated compute in a 3D-stacked package to ease memory capacity bottlenecks. The architecture uses HBM for speed and NAND for large-scale storage, targeting more scalable and cost-efficient AI systems. TrendFore

Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications This paper explores how, with chips becoming smaller and mightier, automated x-ray metrology delivers game-changing quality and efficiency in wafer and panel level applications, while delving into industry trends. Technical Paper

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China's semiconductor equipment localization enters a new growth phase Yole Group releases 2026 report on Mainland China semiconductor equipment industry, showing accelerating AI-driven demand and memory expansion. Boosts domestic equipment adoption, raising localization from 8% in 2021 to 23.2% in 2025, projected 39% by 2030. Yole Group

ASML, TSMC and imec present 300mm integration route for industry-ready 2D-material-based transistors imec, with ASML and TSMC demonstrates scalable 300mm integration of 2D-material nFETs and pFETs using MoS2, WS2, and WSe2 channels. The team achieves 50nm contacted poly pitch with EUV lithography, advancing CMOS-like ultra-scaled transistor development. Semiconductor Today

Sponsor Dedicated Tool for Process Development Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis. Uyemura

Technical Papers Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications MORE TECHNICAL PAPERS

Sponsor Proven SiPaste® for Ultrafine-Pitch Printing Boost SPI yields with SiPaste® C312HF. Formulated for fine feature printing, it combines best-in-class stencil print transfer efficiency and excellent stencil life. Indium Corporation

GlobalFoundries, Qualinx Put Europe's Chip Sovereignty to the Fab Test GlobalFoundries & Qualinx complete the first European end-to-end semiconductor manufacturing flow at Dresden, producing a secure GNSS SoC for critical applications They highlight improved onshore supply chains but note Europe still lacks autonomy due to EDA design constraints EE Times

China hits US rare earth companies with export bans China has imposed export controls on US rare earth firms MP Materials and USA Rare Earth, citing national security. The move targets Washington's supply chain push, restricts dual-use exports, and escalates trade tensions over critical minerals. Taipei Times

Sponsor Die-on-Tab for Compound Semiconductors This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now. StratEdge Corporation

Software to Silicon With RISC-V for Physical AI Panel moderated by Nitin Dahad of EE Times, featuring Sameer Wasson and Andrea Gallo, explored rethinking chip design for agentic AI and assessed how GlobalFoundries and Synopsys acquisitions reshape customer impacts. EE Times

Rapidus Completes 150 Billion Yen Funding Round from Japan Government Rapidus secures 150 billion yen ($943 million) from Japan's IPA, lifting total funding to 424.95 billion yen. The company accelerates plans to build 2nm semiconductor manufacturing by 2027 with strong public and private investment support ecosystem. 3DInCites

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Will Your Chip's Memory Work As Expected? Rising chip density, multi-die designs & AI adoption are increasing memory reliability challenges. Synopsys' Yervant Zorian advocates workload-specific testing that combines multiple methods, multi-physics simulations & digital twins to improve reliability across diverse systems. Semiconductor Engineering

SK hynix beats Samsung Electronics in market cap to become most valuable company SK hynix surpassed Samsung Electronics to become South Korea's most valuable listed company after shares jumped 5.61%, driven by AI-fueled demand for HBM chips, while Samsung's diversified portfolio lagged in the semiconductor stock market rally amid AI boom. Yonhap News Agency

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Mask Economics Shape High-NA EUV Adoption Semiconductor experts are tackling new mask technology challenges as advanced lithography pushes manufacturing limits. Leaders from across the industry highlight technical hurdles, rising production demands, and innovations driving next-generation chip fabrication. Semiconductor Engineering

Sponsor SQ7000+TM Multi-Function for 3D AOI, SPI & CMM The SQ7000+ with MRS® sensor technology delivers high-resolution, high-speed inspection and metrology, uniquely combining AOI, SPI, and CMM in one in-line system. Nordson Test & Inspection