December 23, 2025

What Comes Next for Arduino after Qualcomm’s Acquisition? After Qualcomm acquired Arduino, the company assured developers it will retain its open-source philosophy. The new Uno Q platform unifies Linux compute with real-time microcontrollers, simplifying development for edge AI, robotics, home automation, and industrial applications. EE Times

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EDITORIAL: What is ahead for the AI industry Taiwan’s central bank raised its GDP growth forecast to 7.31 percent this year, citing strong AI-driven exports and private investment, while warning that capital outflows, AI market corrections, and complex industry financing pose financial stability risks. Taipei Times

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation. Technical Paper

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Global server shipments to reach 15m: consultancy Global server shipments are set to soar from 4 million this year to 15 million in 2026, with AI servers making up 30 percent, driven by $450 million in cloud provider spending and Nvidia’s upcoming Vera Rubin platform reshaping cooling and integration demands. Taipei Times

AI prompts fastest economic growth in 15 years Academia Sinica sharply raised Taiwan’s 2025 GDP forecast to 7.41 percent, driven by booming AI hardware exports. Strong overseas demand fuels trade-led growth, though structural imbalances and US trade uncertainties pose risks to long-term economic resilience. Taipei Times

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Technical Papers Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG A Universal AI-Powered Segmentation Model for PCBA & Semiconductor Peer viewpoint: semiconductor innovation for telecommunication networks MORE TECHNICAL PAPERS

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IFTLE 651: Intel and Amkor Join Forces for EMIB Amkor and Intel are partnering to scale high-volume manufacturing of Intel’s EMIB packaging across Korea, Portugal, and Arizona, addressing AI-driven demand, strengthening the U.S. supply chain, and offering alternatives to TSMC’s constrained advanced packaging capacity. 3DInCites

Broadcom Hardens Storage Security Against Quantum Threats Broadcom unveiled its Gen 8 Fibre Channel 128G SAN switches, including Brocade X8 Directors and G820 56-port models, delivering high-performance storage, AI-ready workloads, and quantum-safe security with AES-256 encryption and post-quantum algorithms for enterprise resilience. EE Times

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Research Bits: Dec. 22 Researchers from USC, UW-Madison, Purdue, and UIUC advanced photonic computing by developing regenerative optical memory, single-photon switches, and slow-light photonic chips. These innovations enable energy-efficient, scalable, and tunable light-based memory and processing for future AI accelerators. Semiconductor Engineering

AI was behind over 50,000 layoffs in 2025 — here are the top firms to cite it for job cuts In 2025, U.S. companies announced 1.17 million layoffs, the highest since 2020, with AI cited in 55,000 cuts. Firms like Amazon leveraged AI to streamline operations, while experts caution that overhiring and cost-cutting also drove the job reductions. CNBC

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Moore Threads unveils new AI chips to challenge Nvidia Chinese chipmaker Moore Threads Technology unveiled its new AI-focused Huashan and high-performance Lushan chips, claiming superior performance to Nvidia’s Hopper series. The launch, following its blockbuster Shanghai IPO, signals Moore Threads’ bid to challenge global rivals in AI and gaming markets. South China Morning Post

Samsung, SK hynix accelerate memory output amid AI boom South Korean chipmakers are boosting memory output to meet surging AI server demand, with Samsung and SK hynix expanding DRAM, NAND and HBM capacity, investing in new fabs as analysts project the global DRAM market to reach $170 billion by 2026. Yonhap News Agency

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Inside Intel's New Arizona Fab, Where the Chipmaker's Fate Hangs in the Balance Intel has begun high-volume production of its 18A chip node, betting it can revive competitiveness, but struggles to attract external customers amid yield challenges and entrenched reliance on TSMC. For now, Intel remains its own primary client. CNBC

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