Die Bonding Made Easy
The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO. DL Technology
Technical Paper
A New Optical Ball Grid Array Package Development for Automotive Optical Sensor
This study develops a robust optical ball grid array package for automotive image sensors, optimizing materials, design, and processes to mitigate thermal stresses, improve reliability, and meet stringent ADAS qualification requirements.
Amkor Technology, Inc.
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