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Die-to-Wafer Bonding Simplified
Researchers developed a plasma Die-to-Wafer bonding process, eliminating complex carrier wafers & costly vacuum systems, enhancing 3DIC & integrated photonics applications.
Ontos Equipment Systems
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Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging
As advanced packaging density increases, alpha particle emissions present a growing reliability risk. This article examines soft error mechanisms and solutions to mitigate failures in AI, HPC, and high-density packages.
MacDermid Alpha Electronics Solutions
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Buy Ceramic Dispensing Needles Online
Ceramic needles with Luer Lok for conductive epoxies and encapsulation. The ceramic molding process allows for smaller more precise inner diameters with a glass like finish. Buy Online.
DL Technology
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