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Die Attach Material Comparisons
Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability.
StratEdge Corporation

Technical Paper

Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging

As advanced packaging density increases, alpha particle emissions present a growing reliability risk. This article examines soft error mechanisms and solutions to mitigate failures in AI, HPC, and high-density packages.
MacDermid Alpha Electronics Solutions

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More Technical Papers

■	A New Optical Ball Grid Array Package Development for Automotive Optical Sensor
■	Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications
■	Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging
■	Revolutionizing IC Packaging with High-Density RDL Technology
■	EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices
■	Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems
■	Package Assembly Design Kits: The Future of Advanced Package Design
■	Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications
■	Eliminating Interfacial Delamination in High-Power Automotive Devices
■	RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG

Full Technical Paper List

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High-Speed Mass Ball Transfer With Ultra-SB²®
Ultra-SB²® enables ultra-fast, precise mass solder ball transfer—ideal for advanced packaging and high-throughput semiconductor assembly. Explore Now.
PacTech