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2026 IEEE ECTC – May 26-29 in Orlando
The Electronic Components & Technology Conference delivers the best in packaging, components & microelectronic technologies, held at the JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, FL.
ECTC

Technical Paper

Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging

As advanced packaging density increases, alpha particle emissions present a growing reliability risk. This article examines soft error mechanisms and solutions to mitigate failures in AI, HPC, and high-density packages.
MacDermid Alpha Electronics Solutions

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More Technical Papers

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Full Technical Paper List

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Hermetic Microelectronic Package Seam Seal
Technical paper on technology that delivers a pristine internal atmosphere for hi-rel microelectronic components. Process automation, including AI, and standard tooling utilized in die and wire bonding is standard.
MicroCircuit Laboratories, LLC