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Die Bonding Made Easy
The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO.
DL Technology

Technical Paper

Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging

As advanced packaging density increases, alpha particle emissions present a growing reliability risk. This article examines soft error mechanisms and solutions to mitigate failures in AI, HPC, and high-density packages.
MacDermid Alpha Electronics Solutions

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More Technical Papers

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Full Technical Paper List

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How heterogenous packaging benefits from atmospheric argon plasma
Semiconductor packaging plasma processing improves reliability and yield. Chip manufacturers can rely on plasma processes to enhance applications.
Surfx Technologies