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2026 IEEE ECTC – May 26-29 in Orlando
The Electronic Components & Technology Conference delivers the best in packaging, components & microelectronic technologies, held at the JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, FL.
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Technical Paper

Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging

As advanced packaging density increases, alpha particle emissions present a growing reliability risk. This article examines soft error mechanisms and solutions to mitigate failures in AI, HPC, and high-density packages.
MacDermid Alpha Electronics Solutions

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Full Technical Paper List

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Automatic Grading Without Assistance
Eliminate the need for operators to assess bond testing failure modes at the end of an automation run. Auto grading uses machine vision software to process the test result images.
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