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Fine-Pitch MEMS Bonding Precision
Upgrade MEMS cantilever bonding with LAPLACE^®-CAN. Laser-assisted accuracy, 30µm pitch, and inline repair for perfect wafer probe cards every time.
PacTech

Technical Paper

Peer viewpoint: semiconductor innovation for telecommunication networks

Telecom networks are evolving rapidly to handle higher speeds & volumes. Henkel surveyed 170 semiconductor leaders to reveal how performance, reliability & advanced integration are driving next-gen infrastructure.
Henkel AG & Co.

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Die Attach Material Comparisons
Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability.
StratEdge Corporation