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Non-Contact Solder Jetting for Precision
SB²® eliminates mechanical placement force, enabling stable solder balling for MEMS, fine-pitch, and advanced packaging applications. Explore the process.
PacTech

Technical Paper

5X Faster Die Sorting Accelerates U.S. Semiconductor Manufacturing

Study examines how EtherCAT-networked automation enables high-speed sorting of increasingly small and fragile semiconductor dies. The equipment combines micron-level motion accuracy, gentle handling, inline testing, flexible packaging formats and production-scale throughput.
Beckhoff Automation LLC

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Full Technical Paper List

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Die Attach Material Comparisons
Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability.
StratEdge Corporation