Sponsor

2026 IEEE ECTC – May 26-29 in Orlando
The Electronic Components & Technology Conference delivers the best in packaging, components & microelectronic technologies, held at the JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, FL.
ECTC

Technical Paper

Current Characterization of Various Cu RDL Designs In Wafer Level Packages (WLP)

This study evaluates copper redistribution layer fusing currents in wafer-level packaging through experiments and simulations, finding that silicon thickness significantly improves heat dissipation and fusing performance.
Amkor Technology

Complete this form to download this Technical Paper.

More Technical Papers

■	Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging
■	Revolutionizing IC Packaging with High-Density RDL Technology
■	EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices
■	Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems
■	Package Assembly Design Kits: The Future of Advanced Package Design
■	Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications
■	Eliminating Interfacial Delamination in High-Power Automotive Devices
■	RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
■	A Universal AI-Powered Segmentation Model for PCBA & Semiconductor
■	Peer viewpoint: semiconductor innovation for telecommunication networks

Full Technical Paper List

Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

Automatic Grading Without Assistance
Eliminate the need for operators to assess bond testing failure modes at the end of an automation run. Auto grading uses machine vision software to process the test result images.
xyztec