Sponsor

High-Speed Mass Ball Transfer With Ultra-SB²®
Ultra-SB²® enables ultra-fast, precise mass solder ball transfer—ideal for advanced packaging and high-throughput semiconductor assembly. Explore Now.
PacTech

Technical Paper

Current Characterization of Various Cu RDL Designs In Wafer Level Packages (WLP)

This study evaluates copper redistribution layer fusing currents in wafer-level packaging through experiments and simulations, finding that silicon thickness significantly improves heat dissipation and fusing performance.
Amkor Technology

Complete this form to download this Technical Paper.

More Technical Papers

■	Package Assembly Design Kits: The Future of Advanced Package Design
■	Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications
■	Eliminating Interfacial Delamination in High-Power Automotive Devices
■	RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
■	A Universal AI-Powered Segmentation Model for PCBA & Semiconductor
■	Peer viewpoint: semiconductor innovation for telecommunication networks
■	Current Characterization of Various Cu RDL Designs In Wafer Level Packages (WLP)
■	Peer viewpoint: AI data centers are driving a semiconductor revolution
■	Advanced Microelectronic Packaging and Fiber Optics Technologies for the Military, Defense & Security Industries
■	Analysis Of Multi-Chiplet Package Designs and Requirements for Production Test Simplification

Full Technical Paper List

Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

Discover consistency for your operations
Explore the reliable solutions for jet dispensing, conformal coating, plasma treatment, and selective soldering from Nordson.
Nordson Electronics Solutions