Sponsor |
|
AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
|
|
Technical Paper |
Current Characterization of Various Cu RDL Designs In Wafer Level Packages (WLP)
This study evaluates copper redistribution layer fusing currents in wafer-level packaging through experiments and simulations, finding that silicon thickness significantly improves heat dissipation and fusing performance.
Amkor Technology
Complete this form to download this Technical Paper.
|
|
More Technical Papers
Full Technical Paper List
|
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
Sponsor |
|
Analytical Solutions
Balazs provides analytical services to high-tech industries with a commitment to absolute quality control. As part of Air Liquide, we have a global presence & offer comprehensive solutions.
Balazs Nanoanalysis
|
|
|