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Real-Time Metrology Solutions
Our systems uses unique Shadow Moiré vision measurement technology for flat surfaces and uses add-on Digital Fringe Projection and Digital Image Correlation technologies.
Akrometrix

Technical Paper

Current Characterization of Various Cu RDL Designs In Wafer Level Packages (WLP)

This study evaluates copper redistribution layer fusing currents in wafer-level packaging through experiments and simulations, finding that silicon thickness significantly improves heat dissipation and fusing performance.
Amkor Technology

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Full Technical Paper List

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Temporary Bonding Materials
Brewer Science offers temporary bonding solutions with high adhesion and high thermal stability (≥ 400˚C) to enable thinning ≤ 50 µm.
Brewer Science