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See WLCSP Defects with Advanced 3D X-ray Microscopy
Two case studies show the effectiveness of high-res 3D XRM for detecting various defects in WLCSP containing RDL & Cu-pillar microbumps. Read more.
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Technical Paper

Current Characterization of Various Cu RDL Designs In Wafer Level Packages (WLP)

This study evaluates copper redistribution layer fusing currents in wafer-level packaging through experiments and simulations, finding that silicon thickness significantly improves heat dissipation and fusing performance.
Amkor Technology

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Thermally Conductive, Low Outgassing Epoxy
Master Bond EP54TC is a thermally conductive, electrically insulating adhesive that combines good physical properties and the ability to transfer heat rapidly and effectively.
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