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Ultra-Thin Wafer Handling
Brewer Science temporary wafer bonding systems allow for safe handling and transport of ultrathin wafers during rigorous backside processing steps.
Brewer Science

Technical Paper

Peer viewpoint: AI data centers are driving a semiconductor revolution

AI adoption is tripling data center demand by 2030. Henkel surveyed 120 semiconductor leaders to uncover how innovation in materials and packaging is powering future-ready, high-performance infrastructure.
Henkel Ltd

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Chemically Resistant, UV Curable Epoxy
Master Bond UV26SP is a low outgassing UV curing system with high temperature and chemical resistance for bonding, sealing and coating.
Master Bond