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			| Technical Paper |  
			| Advanced Microelectronic Packaging and Fiber Optics Technologies for the Military, Defense & Security Industries
 As modern military systems become increasingly compact, autonomous, and software-driven, the need for robust microelectronic integration and secure optical communication grows exponentially.
 Tresky
 
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		| Sponsor |  |   |  Die-to-Wafer Bonding Simplified
 Researchers developed a plasma Die-to-Wafer bonding process, eliminating complex carrier wafers & costly vacuum systems, enhancing 3DIC & integrated photonics applications.
 Ontos Equipment Systems
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