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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
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Technical Paper

Advanced Microelectronic Packaging and Fiber Optics Technologies for the Military, Defense & Security Industries

As modern military systems become increasingly compact, autonomous, and software-driven, the need for robust microelectronic integration and secure optical communication grows exponentially.
Tresky

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1 of 10 Applications: Hybrid Bonding
Swiss made Tresky die bonders can be equipped with an atmospheric plasma unit to provide flawless surfaces on chips or substrates for perfect bond results.
Dr. Tresky AG