AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C Ormet TLPS
Technical Paper
Advanced Microelectronic Packaging and Fiber Optics Technologies for the Military, Defense & Security Industries
As modern military systems become increasingly compact, autonomous, and software-driven, the need for robust microelectronic integration and secure optical communication grows exponentially.
Tresky
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