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Amkor-Technology

A Hybrid PLP Technology Based On A 650 X 650 mm Platform
Multiple fan-out wafers or subpanels are assembled on a carrier panel with reduced cost in the RDL process. Read more.
Amkor Technology, Inc.
Ormet-TLPS
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Circuit-Technology-Center

BGA Component Rework Simplified
When you're confronted with tough BGA rework, who do you turn to? Discover the #1 resource used by military contractors. We have solutions for all your BGA rework and repair needs.
Circuit Technology Center
ZEISS