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A study about 3D stacking of passive SMD elements
This study demonstrates laser assisted bonding (LAB) of SMD Tantal Elko and MLCC capacitors and presents a comparison to conventional bonding using solder paste and reflow oven.
PacTech

Technical Paper

The Economics of Electronic Component Salvage and Reuse

This paper explores the feasibility and benefits of salvaging and reconditioning the leads and pads of electronic components, focusing on high-value components such as microprocessors, microcontrollers, and artificial intelligence chips.
Circuit Technology Center Inc.

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More Technical Papers

■	Analysis Of Multi-Chiplet Package Designs and Requirements for Production Test Simplification
■	The Evolution of Inspection and Metrology in the AI Era
■	The Economics of Electronic Component Salvage and Reuse
■	How Precision Motion Systems are Shaping the Future of Semiconductor Manufacturing
■	Reducing CTE Mismatch Defects in Flip Chip Reflow
■	Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield
■	A study about 3D stacking of passive SMD elements for advanced SMT packaging using laser assisted bonding
■	Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components
■	In situ hydrogen plasmas — A New Paradigm for Advanced Packaging
■	Multi-Sensor Metrology for the most challenging Advanced Packaging Applications

Full Technical Paper List

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TrueFlat by BTU: Ensuring Consistent Flatness in Every Reflow Cycle.
BTU presents the Pyramax TrueFlat reflow oven. Say goodbye to substrate warpage and hello to reliable, repeatable flatness. Discover the TrueFlat advantage now!
BTU International