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3 Ways to Increase Plasma Uniformity
Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more.
Plasma Etch

Technical Paper

The Economics of Electronic Component Salvage and Reuse

This paper explores the feasibility and benefits of salvaging and reconditioning the leads and pads of electronic components, focusing on high-value components such as microprocessors, microcontrollers, and artificial intelligence chips.
Circuit Technology Center Inc.

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Hermetic Package Automation with HDHS® Technology
Enables Seam Sealing with industry standard tooling including Auer carriers and custom carriers including non-standard square trays. Rapid switchover from one carrier tooling to the next is a PC program change.
MicroCircuit Laboratories, LLC