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A study about 3D stacking of passive SMD elements
This study demonstrates laser assisted bonding (LAB) of SMD Tantal Elko and MLCC capacitors and presents a comparison to conventional bonding using solder paste and reflow oven.
PacTech

Technical Paper

How Precision Motion Systems are Shaping the Future of Semiconductor Manufacturing

This paper explores how precision motion systems enable key semiconductor manufacturing trends—such as node scaling, advanced packaging, and photonic integration—by delivering the accuracy required for nanoscale production and testing.
Aerotech

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More Technical Papers

■	Analysis Of Multi-Chiplet Package Designs and Requirements for Production Test Simplification
■	The Evolution of Inspection and Metrology in the AI Era
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■	How Precision Motion Systems are Shaping the Future of Semiconductor Manufacturing
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■	A study about 3D stacking of passive SMD elements for advanced SMT packaging using laser assisted bonding
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■	In situ hydrogen plasmas — A New Paradigm for Advanced Packaging
■	Multi-Sensor Metrology for the most challenging Advanced Packaging Applications

Full Technical Paper List

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TrueFlat by BTU: Ensuring Consistent Flatness in Every Reflow Cycle.
BTU presents the Pyramax TrueFlat reflow oven. Say goodbye to substrate warpage and hello to reliable, repeatable flatness. Discover the TrueFlat advantage now!
BTU International