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Technical Paper

Reducing CTE Mismatch Defects in Flip Chip Reflow

TrueFlat technology uses negative pressure reflow and Advanced Thermal Control (ATC) to reduce warpage, micro spikes, and CTE mismatch defects in ultra-miniaturized electronic assemblies with fragile ELK materials.
BTU International, Inc.

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Organic Substrates/High Density Interposers - 20µm Dielectrics - 12µm Traces - 50µm "Stay Flat" Cores - Quick Turns. Learn more.
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