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Remove Underfilled BGAs Without the Risk
Heat-based removal methods can lead to cratering, substrate delamination, and more. Cold precision milling offers a safer solution for BGA removal.
Circuit Technology Center

Technical Paper

Reducing CTE Mismatch Defects in Flip Chip Reflow

TrueFlat technology uses negative pressure reflow and Advanced Thermal Control (ATC) to reduce warpage, micro spikes, and CTE mismatch defects in ultra-miniaturized electronic assemblies with fragile ELK materials.
BTU International, Inc.

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Die Sorting with AI-supported AOI and Infrared Inspection
See Muehlbauer's DS Merlin 60K running live at Semicon SEA, Booth #1811. The world's benchmark in die sorting: ultra-high-speed technology with AI-driven vision inspection down to 1 µm resolution.
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