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Heat-based removal methods can lead to cratering, substrate delamination, and more. Cold precision milling offers a safer solution for BGA removal.
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Technical Paper

Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield

Lead frame packages are commonly used in semiconductor package fabrication, where interconnections between the integrated circuits (IC) and the metal leads are typically established through die attach and wire bonding processes.
ZESTRON

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