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Technical Paper

A study about 3D stacking of passive SMD elements for advanced SMT packaging using laser assisted bonding

This study demonstrates laser assisted bonding (LAB) of SMD Tantal Elko and MLCC (Multilayer Ceramic Chip Capacitor) capacitors and presents a comparison to conventional bonding using solder paste and reflow oven.
PacTech Asia Sdn. Bhd.

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