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Remove Underfilled BGAs Without the Risk
Heat-based removal methods can lead to cratering, substrate delamination, and more. Cold precision milling offers a safer solution for BGA removal.
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Technical Paper

A study about 3D stacking of passive SMD elements for advanced SMT packaging using laser assisted bonding

This study demonstrates laser assisted bonding (LAB) of SMD Tantal Elko and MLCC (Multilayer Ceramic Chip Capacitor) capacitors and presents a comparison to conventional bonding using solder paste and reflow oven.
PacTech Asia Sdn. Bhd.

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