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Packaging Solutions for Unique Markets
The MLF/QFN packaging technology is the fastest-growing IC packaging solution today. MLF/QFN packaging solutions represent a >111B-unit market across five unique markets.
Amkor Technology, Inc.

Technical Paper

A study about 3D stacking of passive SMD elements for advanced SMT packaging using laser assisted bonding

This study demonstrates laser assisted bonding (LAB) of SMD Tantal Elko and MLCC (Multilayer Ceramic Chip Capacitor) capacitors and presents a comparison to conventional bonding using solder paste and reflow oven.
PacTech Asia Sdn. Bhd.

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94GHz Elastomer Socket BGA1440
Test a 75 watt BGA device with high performance elastomer using a simple swivel lid mechanism. Elastomer connects each signal with -1dB insertion loss
Pic: C24548.jpg
Ironwood Electronics