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A study about 3D stacking of passive SMD elements
This study demonstrates laser assisted bonding (LAB) of SMD Tantal Elko and MLCC capacitors and presents a comparison to conventional bonding using solder paste and reflow oven.
PacTech

Technical Paper

Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components

In this paper we will review how proper cleaning strategies are critical to ensuring long-term reliability in advanced packages and explore how optimized cleaning solutions can help safeguard performance and prevent failure in high-reliability applications.
Zestron Corporation

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More Technical Papers

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■	A study about 3D stacking of passive SMD elements for advanced SMT packaging using laser assisted bonding
■	Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components
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Full Technical Paper List

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Sponsor

TrueFlat by BTU: Ensuring Consistent Flatness in Every Reflow Cycle.
BTU presents the Pyramax TrueFlat reflow oven. Say goodbye to substrate warpage and hello to reliable, repeatable flatness. Discover the TrueFlat advantage now!
BTU International