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IR Layer Release Technology for 3D Packaging and Logic Scaling
Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling.
EV Group

Technical Paper

Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components

In this paper we will review how proper cleaning strategies are critical to ensuring long-term reliability in advanced packages and explore how optimized cleaning solutions can help safeguard performance and prevent failure in high-reliability applications.
Zestron Corporation

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Sponsor

Multi-Sensor Metrology
Users want to measure various applications on one tool rather than several tools to get the required results. Ultra-precise, non-contact measuring techniques work for packaging applications.
Camtek