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Advanced Packaging for Next-Generation Vehicle
As cars move to a central computing architecture, splitting SoCs into chiplets becomes a logical solution to size and cost challenges. Read more.
Amkor Technology, Inc.

Technical Paper

Multi-Sensor Metrology for the most challenging Advanced Packaging Applications

Users want to measure various applications on one tool rather than several tools to get the required results. Ultra-precise, non-contact measuring techniques work for a multitude of packaging applications.
Camtek

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Sponsor

1 of 10 Applications: Flip-Chip
Flip chip bonding at an accuracy of 5 µm or better is simple with Swiss made Tresky die bonders, at temperatures of up to 400°C, both in manual and in semiautomatic mode.
Dr. Tresky AG