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Die-on-Tab for Compound Semiconductors
This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now.
StratEdge Corporation

Technical Paper

Effect of Package Warpage and Composite CTE on Failure Modes in Board-Level Thermal Cycling

This paper studies board level reliability for surface mount devices during thermal cycling, while specifying failure modes and locations. Failure modes are characterized using thermal warpage and surface strain data.
Akrometrix

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Handheld Plasma Activation
Plug it in and start cleaning; no gas hookup! Versatile all-in-one solution you can take anywhere and activate almost anything in seconds! Learn more.
Plasma Etch