Hi-Rel Hermetic Package Sealing
Automated processing by the Robotic Cover Sealer. No skilled manual labor in cover seal. Robotic Materials Manager walk away automation provides rapid ROI. MicroCircuit Laboratories, LLC
Technical Paper
Package Integrated Vapor Chamber Heat Spreaders
Advances in vapor chamber technology revolutionize thermal management, delivering up to 12.5°C cooler performance than copper spreaders. These integrated chambers now enhance efficiency in smartphones, high-performance GPUs, and other high-power computing devices.
Amkor Technology, Inc.
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Ultra-Thin Wafer Handling
Brewer Science temporary wafer bonding systems allow for safe handling and transport of ultrathin wafers during rigorous backside processing steps. Brewer Science