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Advanced Packaging for Next-Generation Vehicle
As cars move to a central computing architecture, splitting SoCs into chiplets becomes a logical solution to size and cost challenges. Read more.
Amkor Technology, Inc.

Technical Paper

Package Integrated Vapor Chamber Heat Spreaders

Advances in vapor chamber technology revolutionize thermal management, delivering up to 12.5°C cooler performance than copper spreaders. These integrated chambers now enhance efficiency in smartphones, high-performance GPUs, and other high-power computing devices.
Amkor Technology, Inc.

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1 of 10 Applications: Flip-Chip
Flip chip bonding at an accuracy of 5 µm or better is simple with Swiss made Tresky die bonders, at temperatures of up to 400°C, both in manual and in semiautomatic mode.
Dr. Tresky AG