Sponsor

Advanced Packaging for Next-Generation Vehicle
As cars move to a central computing architecture, splitting SoCs into chiplets becomes a logical solution to size and cost challenges. Read more.
Amkor Technology, Inc.

Technical Paper

Ultrasonic Bonding in semiconductor industry – The fast and clean process

Ultrasonic die bonding revolutionizes semiconductor assembly with rapid processing, strong bonds, and low thermal stress. It excels in bonding dissimilar materials, advancing applications like power devices, RF components, and 3D packaging in modern electronics.
Tresky GmbH

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1 of 10 Applications: Flip-Chip
Flip chip bonding at an accuracy of 5 µm or better is simple with Swiss made Tresky die bonders, at temperatures of up to 400°C, both in manual and in semiautomatic mode.
Dr. Tresky AG