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Tresky

Motivation for pressure-assisted metallic sintering in Power Electronics
Paper provides an understanding of motivations and practical implications of pressure-assisted metallic sintering for power electronics.
Tresky Automation
SEIKA-America
Technical Paper

Plasma as a Key Technology: Increasing Efficiency and Quality Assurance in the Electronics Industry



Plasma technology improves electronics manufacturing, reduces oxide layers without the use of flux, prevents delamination, improves adhesion and enables environmentally friendly, high performance products by using Openair-Plasma® and PlasmaPlus®.
Plasmatreat GmbH

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Circuit-Technology-Center

Tech Paper - Keys to Component Lead Tinning Success
This paper examines the challenges and best practices of component tinning, with a focus on temperature control, flux selection, and soldering techniques.
Circuit Technology Center
Balazs-Nanoanalysis