Sponsor

IR Layer Release Technology for 3D Packaging and Logic Scaling
Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling.
EV Group

Technical Paper

Plasma as a Key Technology: Increasing Efficiency and Quality Assurance in the Electronics Industry

Plasma technology improves electronics manufacturing, reduces oxide layers without the use of flux, prevents delamination, improves adhesion and enables environmentally friendly, high performance products by using Openair-Plasma® and PlasmaPlus®.
Plasmatreat GmbH

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Sponsor

Multi-Sensor Metrology
Users want to measure various applications on one tool rather than several tools to get the required results. Ultra-precise, non-contact measuring techniques work for packaging applications.
Camtek