Particle-Free Plasma Oxide Reduction
Turnkey plasma systems for semiconductor packaging. Highly reliable. Perfect for high-mix or high-volume manufacturing. Learn more. Surfx Technologies
Technical Paper
In situ hydrogen plasmas A New Paradigm for Advanced Packaging
In situ hydrogen plasmas are critical for developing 3D chips with dense interconnects and high signal speeds. Atmospheric pressure hydrogen plasma offers a reliable, flux-free method for oxide removal before thermocompression bonding.
Surfx Technologies, LLC
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Tough Engineering Changes? Where Can You Turn?
Engineering changes are a reality that need to be dealt with. Do you have qualified rework technicians to do the job efficiently and reliably? Circuit Technology Center