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Tech Paper - Keys to Component Lead Tinning Success
This paper examines the challenges and best practices of component tinning, with a focus on temperature control, flux selection, and soldering techniques.
Circuit Technology Center

Technical Paper

In situ hydrogen plasmas — A New Paradigm for Advanced Packaging

In situ hydrogen plasmas are critical for developing 3D chips with dense interconnects and high signal speeds. Atmospheric pressure hydrogen plasma offers a reliable, flux-free method for oxide removal before thermocompression bonding.
Surfx Technologies, LLC

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See WLCSP Defects with Advanced 3D X-ray Microscopy
Two case studies show the effectiveness of high-res 3D XRM for detecting various defects in WLCSP containing RDL & Cu-pillar microbumps. Read more.
ZEISS Microscopy