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Hi-Rel Hermetic Package Sealing
Automated processing by the Robotic Cover Sealer. No skilled manual labor in cover seal. Robotic Materials Manager walk away automation provides rapid ROI.
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Technical Paper

In situ hydrogen plasmas — A New Paradigm for Advanced Packaging

In situ hydrogen plasmas are critical for developing 3D chips with dense interconnects and high signal speeds. Atmospheric pressure hydrogen plasma offers a reliable, flux-free method for oxide removal before thermocompression bonding.
Surfx Technologies, LLC

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