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Technical Paper

In situ hydrogen plasmas — A New Paradigm for Advanced Packaging

In situ hydrogen plasmas are critical for developing 3D chips with dense interconnects and high signal speeds. Atmospheric pressure hydrogen plasma offers a reliable, flux-free method for oxide removal before thermocompression bonding.
Surfx Technologies, LLC

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Magazine loader to test lead frames
Hands-free automatic bond testing with a Sigma MAG magazine handler. Optional with SEMI S2 safety cabinet and/or loadport for top and front-loading (OHT and AGV).
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