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Packaging Solutions for Unique Markets
The MLF/QFN packaging technology is the fastest-growing IC packaging solution today. MLF/QFN packaging solutions represent a >111B-unit market across five unique markets.
Amkor Technology, Inc.

Technical Paper

In situ hydrogen plasmas — A New Paradigm for Advanced Packaging

In situ hydrogen plasmas are critical for developing 3D chips with dense interconnects and high signal speeds. Atmospheric pressure hydrogen plasma offers a reliable, flux-free method for oxide removal before thermocompression bonding.
Surfx Technologies, LLC

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Die Bonding Made Easy
The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO.
DL Technology