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A study about 3D stacking of passive SMD elements
This study demonstrates laser assisted bonding (LAB) of SMD Tantal Elko and MLCC capacitors and presents a comparison to conventional bonding using solder paste and reflow oven.
PacTech

Technical Paper

Enabling A Chiplet Supply Chain

Chiplet-based architectures are on the rise, offering smaller die sizes and improved yields over large SoCs. Despite benefits in cost and performance, challenges like power management, security, and supply chain complexity persist, with UCIe pushing for standardization.
Amkor Technology, Inc.

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TrueFlat by BTU: Ensuring Consistent Flatness in Every Reflow Cycle.
BTU presents the Pyramax TrueFlat reflow oven. Say goodbye to substrate warpage and hello to reliable, repeatable flatness. Discover the TrueFlat advantage now!
BTU International