Sponsor

IR Layer Release Technology for 3D Packaging and Logic Scaling
Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling.
EV Group

Technical Paper

Incorporating EOTPR in Chip-Level Failure Analysis Workflow: Case Studies

The paper showcases six failure analysis case studies comparing TeraView’s Electro Optical Terahertz Time Reflectometry (EOTPR) with other electrical fault isolation techniques. It highlights EOTPR's ability to isolate faults in advanced IC packaging such as CoWoS.
TeraView

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Sponsor

Multi-Sensor Metrology
Users want to measure various applications on one tool rather than several tools to get the required results. Ultra-precise, non-contact measuring techniques work for packaging applications.
Camtek