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Die Attach Material Comparisons
Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability.
StratEdge Corporation

Technical Paper

Incorporating EOTPR in Chip-Level Failure Analysis Workflow: Case Studies

The paper showcases six failure analysis case studies comparing TeraView’s Electro Optical Terahertz Time Reflectometry (EOTPR) with other electrical fault isolation techniques. It highlights EOTPR's ability to isolate faults in advanced IC packaging such as CoWoS.
TeraView

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High-Speed Mass Ball Transfer With Ultra-SB²®
Ultra-SB²® enables ultra-fast, precise mass solder ball transfer—ideal for advanced packaging and high-throughput semiconductor assembly. Explore Now.
PacTech