Sponsor

Real-Time Metrology Solutions
Our systems uses unique Shadow Moiré vision measurement technology for flat surfaces and uses add-on Digital Fringe Projection and Digital Image Correlation technologies.
Akrometrix

Technical Paper

A Hybrid PLP Technology Based On A 650 X 650 mm Platform

A novel panel-level packaging technology, Hybrid PLP, reduces costs by enabling the processing of multiple wafers on a large 650mm x 650mm panel. It enhances reliability and flexibility for advanced chip applications.
Amkor Technology, Inc.

Complete this form to download this Technical Paper.

More Technical Papers

■	Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications
■	Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging
■	Revolutionizing IC Packaging with High-Density RDL Technology
■	EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices
■	Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems
■	Package Assembly Design Kits: The Future of Advanced Package Design
■	Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications
■	Eliminating Interfacial Delamination in High-Power Automotive Devices
■	RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
■	A Universal AI-Powered Segmentation Model for PCBA & Semiconductor

Full Technical Paper List

Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

Temporary Bonding Materials
Brewer Science offers temporary bonding solutions with high adhesion and high thermal stability (≥ 400˚C) to enable thinning ≤ 50 µm.
Brewer Science