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Die Bonding Made Easy
The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO.
DL Technology

Technical Paper

Atmospheric Plasma Simplifies Die-to-Wafer Bonding

We present a simple Die-to-Wafer bonding process enabled by atmospheric plasma, eliminating the need for complicated carrier wafers and costly vacuum plasma systems. Applications include heterogeneous 3DIC and integrated photonics.
ONTOS Equipment Systems

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How heterogenous packaging benefits from atmospheric argon plasma
Semiconductor packaging plasma processing improves reliability and yield. Chip manufacturers can rely on plasma processes to enhance applications.
Surfx Technologies