| Industry Paper |
Atmospheric Plasma Simplifies Die-to-Wafer Bonding
We present a simple Die-to-Wafer bonding process enabled by atmospheric plasma, eliminating the need for complicated carrier wafers and costly vacuum plasma systems. Applications include heterogeneous 3DIC and integrated photonics.
ONTOS Equipment Systems
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Plasma as a Key Technology
Plasma technology improves electronics manufacturing, reduces oxide layers, prevents delamination & enables environmentally friendly products by using Openair-Plasma® & PlasmaPlus®.
Plasmatreat GmbH
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