Sponsor

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura

Technical Paper

Atmospheric Plasma Simplifies Die-to-Wafer Bonding

We present a simple Die-to-Wafer bonding process enabled by atmospheric plasma, eliminating the need for complicated carrier wafers and costly vacuum plasma systems. Applications include heterogeneous 3DIC and integrated photonics.
ONTOS Equipment Systems

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Sponsor

IR Layer Release Technology for 3D Packaging and Logic Scaling
Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling.
EV Group