| Industry Paper |
Cleaning of Silicone and Hydrocarbon Contact Residue Using Atmospheric Plasma
Contact residue from dicing tape and silicone gel trays can cause poor adhesion in chip and wafer bonding applications. ONTOS atmospheric plasma is used to clean surfaces prior to bonding.
ONTOS Equipment Systems
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Plasma as a Key Technology
Plasma technology improves electronics manufacturing, reduces oxide layers, prevents delamination & enables environmentally friendly products by using Openair-Plasma® & PlasmaPlus®.
Plasmatreat GmbH
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