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Die Bonding Made Easy
The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO.
DL Technology

Technical Paper

Cleaning of Silicone and Hydrocarbon Contact Residue Using Atmospheric Plasma

Contact residue from dicing tape and silicone gel trays can cause poor adhesion in chip and wafer bonding applications. ONTOS atmospheric plasma is used to clean surfaces prior to bonding.
ONTOS Equipment Systems

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How heterogenous packaging benefits from atmospheric argon plasma
Semiconductor packaging plasma processing improves reliability and yield. Chip manufacturers can rely on plasma processes to enhance applications.
Surfx Technologies