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FSO Hermetic Package HDHS® Technology
Seam sealing with metal to metal seals and low temperature exposure. Inside the hermetic package the atmosphere is precisely controlled. Auer package tooling reduces handling and contamination.
MicroCircuit Laboratories, LLC

Technical Paper

Cleaning of Silicone and Hydrocarbon Contact Residue Using Atmospheric Plasma

Contact residue from dicing tape and silicone gel trays can cause poor adhesion in chip and wafer bonding applications. ONTOS atmospheric plasma is used to clean surfaces prior to bonding.
ONTOS Equipment Systems

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Elevate Efficiency: MRSI-H1 Die Bonder
Transform your assembly with precision and speed. Discover unparalleled quality and efficiency.
MRSI