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Motivation for pressure-assisted metallic sintering in Power Electronics
Paper provides an understanding of motivations and practical implications of pressure-assisted metallic sintering for power electronics by embracing an innovative technique.
Tresky Automation
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AIT ORMET® TLPS for Component Attach
AIT ORMET® TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
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