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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
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Technical Paper

Motivation for pressure-assisted metallic sintering in Power Electronics

Paper provides an understanding of motivations and practical implications of pressure-assisted metallic sintering for power electronics by embracing an innovative technique.
Tresky Automation

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Thermally Conductive, Low Outgassing Epoxy
Master Bond EP4UF-80 is a thermally conductive, electrically insulating adhesive that offers high mechanical strength and is used for underfill applications.
Master Bond