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Tresky
Lab Bonder for Microelectronics & Photonics
Tresky's Lab Bonder for advanced packaging provides accuracy of ±0.7 μm for reproducible submicron bonding processes in R&D and emerging applications.
Tresky
WS-641 - Flip Chip Flux
Industry Paper

Motivation for pressure-assisted metallic sintering in Power Electronics

Paper provides an understanding of motivations and practical implications of pressure-assisted metallic sintering for power electronics by embracing an innovative technique.
Tresky Automation
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DL Technology
Micro Dispensing Technology White Paper
The trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size.
DL Technology