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FSO and LiDAR hermetic microelectronic miniature packages
Largest area lenses in covers are routine for Robotic Cover Sealer with Automated Processing. Robotic Materials Manager provides walk away automation.
MicroCircuit Laboratories, LLC

Technical Paper

Motivation for pressure-assisted metallic sintering in Power Electronics

Paper provides an understanding of motivations and practical implications of pressure-assisted metallic sintering for power electronics by embracing an innovative technique.
Tresky Automation

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Large Capacity Plasma Treatment System - FlexTRAK-SHS
9.6-liter plasma process chamber handles larger, or more, strips increasing throughput and productivity for electronics/semiconductor packaging.
Nordson Electronics Solutions