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Full automation bond testers
A Sigma eliminates human error and comes with game-changing automation capabilities, robotic handlers, and smart vision cameras for operator-free bond testing and analysis. Learn more.
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Technical Paper

Motivation for pressure-assisted metallic sintering in Power Electronics

Paper provides an understanding of motivations and practical implications of pressure-assisted metallic sintering for power electronics by embracing an innovative technique.
Tresky Automation

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3 Ways to Increase Plasma Uniformity
Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more.
Plasma Etch