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Technical Paper

IR Layer Release Technology for 3D Packaging and Logic Scaling



Revolutionary layer transfer approach that enables nanometer-precision release of ultra-thin bonded, deposited or grown layers from silicon carrier substrates using an IR laser and specially formulated inorganic release materials.
EV Group

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Brewer Science offers temporary bonding solutions with high adhesion and high thermal stability (≥ 400˚C) to enable thinning ≤ 50 µm.
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