Real-Time Metrology Solutions
Our systems uses unique Shadow Moiré vision measurement technology for flat surfaces and uses add-on Digital Fringe Projection and Digital Image Correlation technologies. Akrometrix
Technical Paper
IR Layer Release Technology for 3D Packaging and Logic Scaling
Revolutionary layer transfer approach that enables nanometer-precision release of ultra-thin bonded, deposited or grown layers from silicon carrier substrates using an IR laser and specially formulated inorganic release materials.
EV Group
Complete this form to download this Technical Paper.
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
Sponsor
Temporary Bonding Materials
Brewer Science offers temporary bonding solutions with high adhesion and high thermal stability (≥ 400˚C) to enable thinning ≤ 50 µm. Brewer Science