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			| Technical Paper |  
			| Optimized Reflow Solder TIMs Processes for Heterogeneous Packages
 Void rates related to solder TIM (sTIM) layers are studied across different reflow processes including vacuum assisted reflow, formic reflow, and pressurized (autoclave) reflow processes. A joint study between Heller Industries and Indium Corporation.
 Heller Industries, Inc.
 
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		| Sponsor |  |   |  Die-to-Wafer Bonding Simplified
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