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Technical Paper

Optimized Reflow Solder TIMs Processes for Heterogeneous Packages

Void rates related to solder TIM (sTIM) layers are studied across different reflow processes including vacuum assisted reflow, formic reflow, and pressurized (autoclave) reflow processes. A joint study between Heller Industries and Indium Corporation.
Heller Industries, Inc.

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Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more.
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