AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C Ormet TLPS
Technical Paper
Optimized Reflow Solder TIMs Processes for Heterogeneous Packages
Void rates related to solder TIM (sTIM) layers are studied across different reflow processes including vacuum assisted reflow, formic reflow, and pressurized (autoclave) reflow processes. A joint study between Heller Industries and Indium Corporation.
Heller Industries, Inc.
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