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Die Bonding Made Easy
The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO.
DL Technology

Technical Paper

Optimized Reflow Solder TIMs Processes for Heterogeneous Packages

Void rates related to solder TIM (sTIM) layers are studied across different reflow processes including vacuum assisted reflow, formic reflow, and pressurized (autoclave) reflow processes. A joint study between Heller Industries and Indium Corporation.
Heller Industries, Inc.

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Effect of Package Warpage and Composite CT on Failure Modes
Researchers analyze board-level reliability of surface mount devices in thermal cycling, identifying failure modes via warpage and strain data.
Akrometrix