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3 Ways to Increase Plasma Uniformity
Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more.
Plasma Etch

Technical Paper

Optimized Reflow Solder TIMs Processes for Heterogeneous Packages

Void rates related to solder TIM (sTIM) layers are studied across different reflow processes including vacuum assisted reflow, formic reflow, and pressurized (autoclave) reflow processes. A joint study between Heller Industries and Indium Corporation.
Heller Industries, Inc.

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Hermetic Package Automation with HDHS® Technology
Enables Seam Sealing with industry standard tooling including Auer carriers and custom carriers including non-standard square trays. Rapid switchover from one carrier tooling to the next is a PC program change.
MicroCircuit Laboratories, LLC