Sponsor

FSO and LiDAR hermetic microelectronic miniature packages
Largest area lenses in covers are routine for Robotic Cover Sealer with Automated Processing. Robotic Materials Manager provides walk away automation.
MicroCircuit Laboratories, LLC

Technical Paper

Complete Warpage Control for Wafers and Panels

Effective warpage mitigation is increasingly critical for semiconductor advanced packaging applications, such as fan-out. Heller Industries has developed a unique and effective solution for mitigating warpage during mass reflow utilizing a system of recirculating vacuum chucks.
Heller Industries, Inc.

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Sponsor

Large Capacity Plasma Treatment System - FlexTRAK-SHS
9.6-liter plasma process chamber handles larger, or more, strips increasing throughput and productivity for electronics/semiconductor packaging.
Nordson Electronics Solutions