Sponsor

Large Capacity Plasma Treatment System - FlexTRAK-SHS
9.6-liter plasma process chamber handles larger, or more, strips increasing throughput and productivity for electronics/semiconductor packaging.
Nordson Electronics Solutions

Technical Paper

Vertical Laser Assisted Bonding for Advanced 3.5D Chip Packaging

PacTech's "3.5D" Laser Assisted Chip Packaging Technology for vertical connection of chip to die stack and 3D horizontal die stacking (LAPLACE). It's compatible with solder, pillars, ACF and sinter paste.
PacTech-Packaging Technologies GmbH

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Sponsor

LAB Flip Chip Reflow Process Robustness Prediction
Predicting laser-assisted bonding (LAB) parameters and ideal solder temperature range for a black box substrate. Read more.
Amkor Technology, Inc.